You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please, join our community today!
Date and Time Wednesday, May 27, 2020 Time: 10:00am - 11:00am (PDT) Providing the best alternative to advanced monolithic SoCs, multi-chiplet packages have become a very attractive option for the next generation of cost-sensitive designs. However, as many engineers begin to realize the benefits of a multi-chiplet packaging approach, including 3D stacking, they are struggling …
Tokyo Big Sight
3 Chome-11-1 Ariake, Koto City, Tokyo, Japan
December 14-16, 2022 Venue: Tokyo Big Sight SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging …
The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, …
Tuesday, February 21, 2023 8:00 am PT / 11:00 am ET UCIe™ — Universal Chiplet Interconnect Express™ — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration. The newly formed UCIe Consortium fosters an open chiplet …
Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with the dice instantiated in a 3D-IC device. The presentation will then explore the completed multi-chip design in a system simulation. …
