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SEMICON Japan + Advanced Packaging and Chiplet Summit
December 14, 2022 - December 16, 2022
December 14-16, 2022
Venue: Tokyo Big Sight
SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently, bringing together top players in the semiconductor packaging and PCB mounting fields.
Please register in advance and follow the COVID-19 guidelines to help ensure a safe environment.Share this post via: