SEMICON Japan + Advanced Packaging and Chiplet Summit

December 14-16, 2022
Venue: Tokyo Big Sight

SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered by semiconductor technology such as automotive and Internet of Things (IoT). The Advanced Packaging and Chiplet Summit (APCS) will be held concurrently, bringing together top players in the semiconductor packaging and PCB mounting fields.

REGISTER HERE

Please register in advance and follow the COVID-19 guidelines to help ensure a safe environment.

COVID-19 INFECTION CONTROL GUIDELINES