Webinar: Verifying Chiplet-based Systems

Online

Verifying Chiplet-based Systems (online) As the semiconductor industry increasingly embraces chiplet-based architectures, the complexity of system integration and verification has grown exponentially. Verifying these modular systems demands new approaches, tools, and collaboration across design and verification teams. This online edition of DVClub will focus on the challenges, strategies, and breakthroughs in verifying chiplet-based systems. Industry …

Chiplet and Heterogeneous Integration for Microelectronics Packaging – Virtual Training

Online

Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging, Through Silicon Via (TSV), and Fan-out wafer …