48th International Symposium for Testing and Failure Analysis The demand for higher performance and lower power-consumption microelectronic devices has driven semiconductor technology to shrink continuously according to Moore’s Law. Furthermore, for latest technologies in nano realm, a new set of disruptive development in new structures and novel materials was introduced. Thus, defects causing semiconductor device …
This webinar outlines the power integrity, thermal integrity, and signal integrity difficulties in 3D-IC design. TIME: NOVEMBER 3, 2022 11 AM EDT / 3 PM GMT / 8:30 PM IST REGISTER HERE About this Webinar This webinar introduces the Multiphysics requirements to meet performance, integrity, and reliability expectations for 3DICs. Beyond ‘golden solver’ requirements for …
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Boost Simulation Productivity with SimSolid Enhance Your Product Development Process with Rapid Design Point Analysis By performing structural analyses on fully featured CAD assemblies within minutes, SimSolid is the game-changing …
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Date: Tuesday, January 24, 2023 Time: 09:00 GMT / 10:00 CET / 11:00 EET & Israel / 14:30 IST Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office software to provide designers with …
Date: Thursday, January 26, 2023 Time: 09:00 GMT / 10:00 CET / 11:00 EET & Israel / 14:30 IST Static Timing Analysis (STA) aims to validate the timing performance of …
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*Company email required for registration* Register Transfer Level (RTL) power analysis, performed early in the design cycle, is a key component of end-to-end methodology to maximize energy efficiency. Such analysis has become a critical requirement for many IC designs today and in the future. Although RTL power analysis technology has been available to designers for …
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TIME: FEBRUARY 16, 2023 11 AM EST / 3 PM GMT / 8:30 PM IST About this Webinar This 2023 R1 webinar provides insights on the latest Ansys Safety Analysis new features that further extend and complete the efficient, holistic application of safety, reliability, and cybersecurity analysis methods in a high-performance manner. Discover more about …
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This webinar cover the modeling abstraction in the design of electronics, semiconductors and software. This webinar will definitely improve your modeling skills! –Is the abstraction right for your application and design goal? –How do you accelerate the simulation using abstraction? –Can you change the model of computation using abstraction to simplify the modeling effort? During …
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Performance Testing and Analysis Discuss the performance verification challenges posed by complex SoC with distributed cache from cluster, to interconnect to die-to-die. Agenda (BST) 12:00 Welcome and Introduction – Mike Bartley, Tessolve 12:00 Nick Heaton, Cadence Design Systems - SoC Verification in a Multi-chip, Multi-die world 12:30 David Kelf, Breker Verification Systems - Automated SoC Performance and …
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IC package design teams and characterization teams have had a “throw-it-over-the-wall” relationship for decades, which often delays design releases by months. However, as signal integrity (SI) and power integrity (PI) …
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In-Person Seminar - May 3, 2023 Sharon Hotel, Herzliya, Israel Join us for this day-long seminar, where you will learn to apply the full suite of Cadence’s cutting-edge technology platforms …
The fifth/sixth generation (5G/6G) mobile networks support the growth of many applications, such as new entertainment experiences, intelligent autonomous mobility, revolutionizing healthcare, and propelling manufacturing into a new era of smart connected factories. Take advantage of this antenna system Multiphysics and Design Reliability presentation for 5G/6G. TIME: MAY 4, 2023 2:00 PM CET VENUE: VIRTUAL …
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Developing optical payloads for aerospace applications requires multi-physics collaboration. This type of workflow involves designing an optical system and generating opto-mechanical behavior by realistically modelling the structural and thermal impacts experienced by a payload in-orbit. The Ansys software suite offers a streamlined optical simulation workflow that enables Structural-Thermal-Optical-Performance (STOP) analysis for aerospace applications. Interoperability between …
