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SimSolid Webinar Series: Efficient Design Point Analysis of Electronics

November 10, 2022 @ 11:00 AM - 12:00 PM

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Boost Simulation Productivity with SimSolid

Enhance Your Product Development Process with Rapid Design Point Analysis

By performing structural analyses on fully featured CAD assemblies within minutes, SimSolid is the game-changing simulation technology for designers, engineers, and analysts. It eliminates geometry preparation and meshing: the two most time-consuming, expertise-intensive, and error-prone tasks performed in a conventional structural simulation.

GE logoJoin our special guest speaker from GE, Luis Guillermo Vidriales Escobar, during the Accelerate your Digital Transformation webinar on Tuesday, November 8, as he discusses the preliminary design evaluation of complex systems.

Select boundary hardware that is going to be included in HFC analysis, is a critical step that normally relies on analyst experience. There are internal practices widely accepted to do so but having a more accurate prediction of natural frequencies while including more components in a more complex layout, has been found to be helpful to take important decisions toward a more accurate FEA. Altair SimSolid was used to evaluate natural frequencies on a complex system that contained a potential redesign in a tube.

SimSolid Demo Efficient Design Point Analysis of Electronics

Thursday, November 10 | 2pm EST (New York) | 1pm CST (Chicago) | 11am PST (San Francisco)

As simulation continues to play a bigger role in the design cycle of electronics, designers and simulation experts want simulation tools that can quickly deliver results with confidence.  With traditional simulation toolsets requiring defeatured CAD and quality meshes from experts with years of experience, SimSolid changes the game allowing designers and engineers to analyze fully featured CAD without any mesh in significantly less time.

In this webinar, Evan Christensen, Sr. Technical Account Manager, will show two examples:

  •  Modal and static acceleration analyses on a complex printed circuit board (PCB) to assess structural weaknesses.
  • A non-linear contact analysis on a pair of Augmented Reality (AR) glasses to assess changes in projector angles.


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