48th International Symposium for Testing and Failure Analysis The demand for higher performance and lower power-consumption microelectronic devices has driven semiconductor technology to shrink continuously according to Moore’s Law. Furthermore, for latest technologies in nano realm, a new set of disruptive development in new structures and novel materials was introduced. Thus, defects causing semiconductor device …
This webinar outlines the power integrity, thermal integrity, and signal integrity difficulties in 3D-IC design. TIME: NOVEMBER 3, 2022 11 AM EDT / 3 PM GMT / 8:30 PM IST REGISTER HERE About this Webinar This webinar introduces the Multiphysics requirements to meet performance, integrity, and reliability expectations for 3DICs. Beyond ‘golden solver’ requirements for …
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Boost Simulation Productivity with SimSolid Enhance Your Product Development Process with Rapid Design Point Analysis By performing structural analyses on fully featured CAD assemblies within minutes, SimSolid is the game-changing simulation technology for designers, engineers, and analysts. It eliminates geometry preparation and meshing: the two most time-consuming, expertise-intensive, and error-prone tasks performed in a conventional …
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