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48th International Symposium for Testing and Failure Analysis The demand for higher performance and lower power-consumption microelectronic devices has driven semiconductor technology to shrink continuously according to Moore’s Law. Furthermore, …
This webinar outlines the power integrity, thermal integrity, and signal integrity difficulties in 3D-IC design. TIME: NOVEMBER 3, 2022 11 AM EDT / 3 PM GMT / 8:30 PM IST …