TreeHacks 2021
Join us to build apps, hardware, and community as we bring the magic of TreeHacks to your doorstep! TreeHacks 2021 will be the 7th-ever iteration of TreeHacks. Our theme this …
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2021 International Solid-State Circuits Virtual Conference
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working …
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3rd Annual Automotive Safety Online Summit
3rd Annual Automotive Safety Online Summit 16th – 17thFebruary 2021 Zoom flagZoom ONLINE International automotive safety experts are here to discuss the latest innovations in automotive safety of the future …
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Improved Debug and Package Handling for Mixed-Signal Verification
Mixed-signal simulations have unique challenges whether you're running from the command line or within the Cadence® Virtuoso® platform. Where are the interfaces between logic and electrical and are they behaving …
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Be a Cluster Champion! Tune Your Way to MPI Performance
If you want to improve your MPI application performance, this webinar is for you. Find out how a cross-architecture, multi-fabric, message-passing library can help your apps perform better on HPC …
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Addressing Power Integrity with a Fast and Easy Signoff Ready Methodology for Next-Gen. Arm® Cores
Date: February 17, 2021 Time: 10:00 AM PST The next generation of processor cores such as the latest Arm® cores continue to get larger and more complex with challenging power …
Functional Verification of Clock Domain Crossing Issues (US)
Time: 11:00 AM – 12:00 PM (PT) Abstract: ALINT-PRO provides powerful means for static analysis and validation of clock domain crossings(CDC). It extracts and validates clock trees, and clock domains, applying …
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SPIE Advanced Lithography
SPIE Advanced Lithography is a Digital Forum in 2021 We look forward to you joining us 22 - 26 February 2021 Attend the Advanced Lithography Digital Forum, the leading event for …
AI Business Week Digital Symposium
AI Business Week 2021 – Register Now! – On-Demand Thought Leadership with No Distractions AI Business week will take a unique look at the opportunities afforded by effective AI implementation …
Mobile World Congress Shanghai 2021
February 23-February 25, 2021 Join the CEVA team to experience the smart sensing and wireless connectivity technologies that will shape our future. Visit us for a connected, interactive, and fully …
Electrothermal Signoff for 2.5D and 3D-IC Systems
System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be designed within the context of the package and the overall system. Ansys 2.5D/3D-IC multiphysics simulations for prototyping and signoff offer a complete methodology for analyzing …
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Webinar: Klocwork Ensures the Security, Reliability, and Quality of Your Code
Produce Secure, High-quality Code Discover how you can easily produce secure, high-quality code with Klocwork. Klocwork is a static code analysis tool. It checks your code against coding rules. You …
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