TreeHacks 2021
Join us to build apps, hardware, and community as we bring the magic of TreeHacks to your doorstep! TreeHacks 2021 will be the 7th-ever iteration of TreeHacks. Our theme this …
Join us to build apps, hardware, and community as we bring the magic of TreeHacks to your doorstep! TreeHacks 2021 will be the 7th-ever iteration of TreeHacks. Our theme this …
About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working …
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3rd Annual Automotive Safety Online Summit 16th – 17thFebruary 2021 Zoom flagZoom ONLINE International automotive safety experts are here to discuss the latest innovations in automotive safety of the future …
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Mixed-signal simulations have unique challenges whether you're running from the command line or within the Cadence® Virtuoso® platform. Where are the interfaces between logic and electrical and are they behaving …
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If you want to improve your MPI application performance, this webinar is for you. Find out how a cross-architecture, multi-fabric, message-passing library can help your apps perform better on HPC …
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Date: February 17, 2021 Time: 10:00 AM PST The next generation of processor cores such as the latest Arm® cores continue to get larger and more complex with challenging power …
Time: 11:00 AM – 12:00 PM (PT) Abstract: ALINT-PRO provides powerful means for static analysis and validation of clock domain crossings(CDC). It extracts and validates clock trees, and clock domains, applying …
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SPIE Advanced Lithography is a Digital Forum in 2021 We look forward to you joining us 22 - 26 February 2021 Attend the Advanced Lithography Digital Forum, the leading event for …
AI Business Week 2021 – Register Now! – On-Demand Thought Leadership with No Distractions AI Business week will take a unique look at the opportunities afforded by effective AI implementation …
February 23-February 25, 2021 Join the CEVA team to experience the smart sensing and wireless connectivity technologies that will shape our future. Visit us for a connected, interactive, and fully …
System-in-package (SiP) designs for high-performance computing (HPC), high-speed networking, and AI applications are extremely complex. To achieve maximum performance without exceeding tight thermal and power constraints, these chips must be …
Continue reading "Electrothermal Signoff for 2.5D and 3D-IC Systems"
Produce Secure, High-quality Code Discover how you can easily produce secure, high-quality code with Klocwork. Klocwork is a static code analysis tool. It checks your code against coding rules. You …
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