SPIE Advanced Lithography
As the leading global lithography event, the technical program will focus on works in optical lithography, metrology, and EUV. Leaders come to solve challenges in lithography, patterning technologies, and unique …
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LASCAS 2020
WHERE: San José, Costa Rica WHEN: February 25 - 28, 2020 About the Event LASCAS is the flagship conference of the IEEE Circuits and Systems Society in Latin America. Since …
Creating and Evaluating ROMs
February 27, 2020 11:00 AM - 11:20 AM (EST) Venue: Online Make and analyze changes to your simulation to instantly predict results with a reduced-order model (ROM). A ROM is …
ANSYS Structures 2020 R1 Update
February 27, 2020 11:00 AM (EST) Venue: Online ANSYS 2020 R1 empowers ANSYS Mechanical users to go further than ever before with enhancements to improve the handling of complex, highly …
Tech.AD
Europe’s leading technical autonomous vehicle L4+ development conference for the automotive industry Tech.AD is an award-winning international knowledge exchange platform bringing together all stakeholders leading the development and technical future …
DVCon U.S.
The Design and Verification Conference (DVCon) is the leading event covering the application of languages, tools and intellectual property for the design and verification of electronic systems and integrated circuits. …
Introduction to Processing Course
Portland, Oregon Portland, OR, United StatesSemiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless …
$1,195
Failure and Yield Analysis
Portland, OregonMillions of dollars wasted. Lost competitive advantage. Idle manufacturing lines and customer frustrations. These are the all-too-common consequences of semiconductor failures. In today's economy, competent failure analysts are vital to solve …
$2,095
IMAPS Device Packaging 2020
03 Mar 2020 - 05 Mar 2020 Fountain Hills, AZ, USA Join Cadence in Booth 42 at the International Microelectronics Assembly and Packaging Society (IMAPS)’s 16th annual Device Packaging Conference. …
New Block Floating Point Arithmetic Unit for processing AI/ML Workloads in FPGA
Block Floating Point (BFP) is a hybrid of floating-point and fixed-point arithmetic where a block of data is assigned a common exponent. We describe a new arithmetic unit that natively …
Continue reading "New Block Floating Point Arithmetic Unit for processing AI/ML Workloads in FPGA"
ANSYS 2020 R1 – Maxwell Product Update
March 3, 2020 11:00 AM - 12:00 PM (EST) Venue: Online Join us to learn about the new capabilities available in ANSYS Maxwell in our latest release, ANSYS 2020 R1. …
ANSYS Discovery in Action: Predicting and Improving Efficiency in Flow Control Valves
March 3, 2020 11:00 AM (EST) Venue: Online Engineers are constantly trying to increase the efficiency of valves to control fluid flow across a range of operating conditions and valve …