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The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible. This unique event gives attendees a place to network with peers, ask questions of the experts, …
Date: Tuesday, January 24, 2023 Time: 09:00 GMT / 10:00 CET / 11:00 EET & Israel / 14:30 IST Join us for this one-hour CadenceTECHTALK to learn how the Cadence Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office software to provide designers with …
The development of applications like high-performance computing, Artificial Intelligence (AI) processors, and Central Processing Unit (CPU) and Graphical Processing Unit (GPU) chips involves advanced packaging technologies that radically alter traditional design methodologies and flows. Designers of high-speed components are called to co-simulate die, interposers, and package to sign off for their products' signal integrity (SI) …
Summary Edge devices of all types are getting smarter, with the ability to listen to us, understand our gestures, and even recognize us. This intelligence comes from the inferencing capabilities of deep neural networks. Inferencing is compute intensive and can easily overwhelm embedded processors or the limited power budgets of some edge systems. One way …
Exploring how to take your career or skillset to the next level? Attend our webinar on January 25th to learn about the Technical University of Madrid’s online master’s degree Program. TIME: JANUARY 25, 2023 3:00 PM CET / 9:00 AM EST About this Webinar In collaboration with Ansys, the Technical University of Madrid developed an …
Don’t let power-related issues that appear late in the verification cycle impact your project schedule. Register for a webinar that shows you how to catch low-power issues early on. The Cadence low-power solution considers power at every step of the design flow, from architecture to functional verification, analysis, implementation, and signoff. This webinar will focus …
Here at Perforce, we’ve been working to add to and refine our suite of digital creation and collaboration tools. In 2022, we released a number of products and features to …
LIVE WEBINAR | 25 JANUARY 2023 14:00 PM JST Although you have installed NC machine tools, do you find that NC programming is done manually (by hand), which takes a lot of man-hours and leads to carelessness? Or maybe you have trouble passing on technology from veteran engineers? Although you have installed NC machine tools, do you …
It’s no secret that companies worldwide are embracing the cloud like never before. With a combination of flexible deployment models and modern web-based access, the cloud enables experts and non-experts to access on-demand simulation tailored to solve specific problems. Cloud adoption brings opportunities that allow our customers to get more value from our products. Ansys …
Date: Thursday, January 26, 2023 Time: 09:00 GMT / 10:00 CET / 11:00 EET & Israel / 14:30 IST Static Timing Analysis (STA) aims to validate the timing performance of a synchronous design. While it is a well-known concept in modern digital implementation flows, for engineers who are not familiar with STA or others who …
In this webinar, Silvaco will present some of the 2022 Baseline enhancements to our Utmost IV Device Modeling tool. We will introduce the Corner and Retargeting Module, the most recent addition to our modeling software platform, and review some of the newest models and technologies where Silvaco’s Utmost IV is a key contributor. The presentation …
*Company email required for registration* If you are designing chips for high-performance computing (HPC) and data center applications, bandwidth is, of course, a key consideration. However, as data centers get bigger and the required compute power increases, keeping power consumption to a minimum becomes a priority. In addition to power, latency is another key concern …
Discover how a seamless ECAD-MCAD flow increases early design fidelity and allows for innovation in less time and at lower cost. January 26, 2023 at 10:00 AM PST The increase of semiconductor content in electronics systems has been an emerging trend in consumer electronics, white goods, automotive and aerospace industries. The latest packaging technologies allow …