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Interlaken chip-to-chip connectivity IP has been used for many years in networking and switching fabrics to move high throughput data between large chips. With advanced technology nodes, increasing chip sizes and CPU cluster-based designs, Interlaken has found a unique spot as the protocol of choice for low latency, high throughput chip-to-chip connectivity. SiFive is extending …
March 19, 2020 11:00 AM (EDT) Venue: Online Whether you are designing critical software for rail interlocking systems and signaling, automatic train operation, computer-based train control, emergency braking systems, overspeed protection, train vacancy detection or other railway applications, you will need to leverage model-based development tools for high-reliability embedded on-board or wayside train control software, …
March 19, 2020 11:00 AM (EDT) Venue: Online According to a recent survey, 40% of engineers limit the size or amount of detail for every simulation model due to compute capacity and turnaround time constraints. Recognizing this, smaller and mid-sized companies now seek more affordable, accessible and powerful hardware, making high-performance computing (HPC) a necessity. …
Thu, Mar 19, 2020 11:00 AM - 12:00 PM MDT ** Work email address required** Interlaken chip-to-chip connectivity IP has been used for many years in networking and switching fabrics to move high throughput data between large chips. With advanced technology nodes, increasing chip sizes and CPU cluster-based designs, Interlaken has found a unique spot …
Participate in the conference designed for users, by users. Get ready for the biggest and best AMUG Conference ever. There will be more users at the event and more technologies represented. With AMUG’s expanded scope, expert, intermediate and novice users of all commercial additive manufacturing technologies are welcome. Join us from March 22-26, 2020, in Chicago, …
ABOUT AICAS AICAS is an initiative of the IEEE Circuit and Systems Society (CASS) that brings the IEEE CASS together with the explosion of investment in artificial intelligence technology. AICAS aims to stand between ISSCC (solid state circuits) and machine learning conferences like NeurIPS, ICML, ICLR, as major reference conference spanning from theory to physical circuits and systems …
The EuroHPC Summit Week (EHPCSW) 2020 will gather the main European HPC stakeholders from technology suppliers and HPC infrastructures to scientific and industrial HPC users in Europe. As in previous years, PRACE, the Partnership for Advanced Computing in Europe, organises the seventh edition of its Scientific and Industrial Conference (PRACEdays20) within the EHPCSW 2020. PRACEdays20 will bring together experts from academia …
March 23, 2020 9:30 AM - 4:30 PM (PDT) Venue: ANSYS, Inc. 2645 Zanker Road San Jose, CA 95134 USA Contact: Phoebe Lee phoebe.lee@ansys.com Join us for a free hands-on workshop to learn how to perform on chip static and dynamic voltage drop analysis, electromigration, design weakness and hot spot analysis using ANSYS RedHawk. We …
March 23, 2020 11 AM EDT / 3 PM GMT Venue: Online ANSYS Motion is an advanced multibody dynamics solver which enables fast and accurate analysis of rigid and flexible bodies. It evaluates physical events accurately by analyzing the mechanical system as a whole. ANSYS Motion has four tightly integrated solving schemes: rigid body, flexible …
March 24, 2020 9:30 AM - 2:30 PM (PDT) Venue: ANSYS, Inc. 2645 Zanker Road San Jose, CA 95134 USA Contact: Phoebe Lee phoebe.lee@ansys.com Join us for a free hands-on workshop to learn how to perform on chip static and dynamic voltage drop analysis, electromigration, design weakness and hot spot analysis using ANSYS Totem. We will …
Tue, Mar 24, 2020 11:00 AM - 12:00 PM MDT *** This vendor requires that you register with your work email address *** As designs migrate to cutting edge single digit nanometer technologies, designing high yielding products that quickly enter the market is key to remain competitive in the chip industry. Advanced node digital designers …
March 24, 2020 11 AM EDT / 3 PM GMT Venue: Online To develop an optimal product, you must optimize both the structure and the materials. Typically, a huge amount of time and effort is spent refining the structure using simulation, but little attention is paid to the choice of materials. Designers usually choose materials …
March 24, 2020 12:00 PM - 1:00 PM (EDT) Venue: Online Temperature cycling of printed circuit boards can cause failures due to solder fatigue. This is a thermomechanical process that happens due to a mismatch in the coefficients of thermal expansion (CTEs) between the PCB and the components. Too often, the thermal and mechanical simulations …
