ANSYS 2020 R1 – Maxwell Product Update

March 3, 2020 11:00 AM - 12:00 PM (EST) Venue: Online Join us to learn about the new capabilities available in ANSYS Maxwell in our latest release, ANSYS 2020 R1. It includes powerful new features for the design and analysis of electric motors, actuators, transformers and electromechanical devices: Advancements in harmonic force coupling Enhanced demagnetization …

ANSYS Discovery in Action: Predicting and Improving Efficiency in Flow Control Valves

March 3, 2020 11:00 AM (EST) Venue: Online Engineers are constantly trying to increase the efficiency of valves to control fluid flow across a range of operating conditions and valve positions. In this webinar, we will demonstrate how ANSYS Discovery can help you to visualize the flow field and predict performance metrics like pressure drop/flow …

Reach the Highest ISO 26262 ASIL Levels with ANSYS SCADE Solutions for Automotive Embedded Software

March 3, 2020 11:00 AM (EST) Venue: Online While paradigm-changing innovations such as advanced driver assistance systems, electric vehicles and autonomous vehicles are just a few years from production, vehicle makers are struggling to manage the resulting safety and reliability issues. In order to reduce complexity and enhance safety, manufacturers and suppliers must adopt standards …

Educating Future Materials Scientists and Engineers: Challenges & Opportunities

March 3, 2020 11:00 AM (EST) Venue: Online Materials scientists and engineers focus on understanding, improving and developing materials to design new product applications. Additionally, these experts must manage logistics surrounding material price stability, supply chain security, complex restrictions and reporting requirements, stringent environmental concerns, materials circularity, social responsibility and material access restrictions. Materials scientists …

Advanced CMOS/FinFET Fabrication

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today’s microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry’s ability to track something known as Moore’s Law. Moore’s Law states that an integrated circuit’s …

ANSYS Discovery SpaceClaim: Latest Updates in ANSYS 2020 R1

March 4, 2020 11:00 AM (EST) Venue: Online ANSYS 2020 R1 introduces exciting new updates for ANSYS Discovery SpaceClaim. This will empower users to perform autoskin operations on open faceted bodies, simplifying the combination of analytic geometry with autoskinned patches during the reverse engineering process. Additionally, Discovery SpaceClaim integrates two new minimal surface lattices to …

How to Design and Validate with AEC Grade 0

March 4, 2020 12:00PM - 13:00PM (EST) Venue: Online As the automotive industry undergoes radical transformation with electrification and autonomy, there is an increasing need for semiconductor devices that last longer and can operate at higher temperatures. In response, the Automotive Electronics Council (AEC) released a new grade of electronic parts rated to 150 C. …

IC Packaging Technology

Portland, Oregon

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: (1) pitch conversion between the fine features of the IC die and the system level interconnection, (2) chemical, environmental and mechanical protection, (3) heat transfer, (4) power, ground and signal distribution between the die and system, (5) …

$1,195

Best Practices for CFD Meshing

Thu, Mar 5, 2020 10:00 AM - 10:45 AM MST In this webinar we will discuss best practice for traditional CFD meshing using Workbench mesher. Recommendations will be made regarding meshing pitfalls, things to avoid, how to verify your mesh is acceptable, etc.

Consistent Materials Data for Simulation Across ANSYS Solvers

March 5, 2020 11:00 AM (EST) Venue: Online In this webinar, you’ll see how the Materials Data for Simulation dataset supports multiple simulation tools, including ANSYS Mechanical and ANSYS Maxwell. This dataset provides broad coverage of engineering materials in one place, with property data for structural analysis, low frequency electromagnetic analysis and much more. Learn …

The Optical Networking and Communication Conference & Exhibition (OFC)

CONFERENCE ARCHIVES 2019 – San Diego, California, USA Program PDF Conference Papers Technical Sessions Authors and Presiders View Presentations Previous Years The Premier Event in Telecom and Data Center Optics OFC is the largest global conference and exhibition for optical communications and networking professionals. The program is comprehensive -- from research to marketplace, from components to …

Webinar: Improving SI/PI Simulation of DDR Interfaces at the PCB/IC Package Level

Double data rate (DDR) synchronous dynamic random-access memory (SDRAM) is the common type of memory used as RAM for almost every modern processor. With DDR memory interface voltages decreasing, speeds increasing, and timing/power budgets being squeezed, design qualification using the latest memory interfaces is no small challenge. Join Cadence Training and Srdjan Djordjevic, Sigrity Expert …