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IEDM 2022 is shaping up

IEDM 2022 is shaping up
by Scotten Jones on 07-17-2022 at 10:00 am

68th iedm color

IEDM is one of the premiere conferences for the latest information on leading edge semiconductor technology. The 68th annual International Electron Devices Meeting will be held December 3rd through 7th at the San Francisco Hilton.

The paper submission deadline is July 14, 2022, and the late-news deadline is August 22, 2022. The conference will be an in-person event, with on-demand access to recorded presentations afterward for those who cannot travel due to COVID-19 restrictions.

“Our conference began just a few years after the transistor was invented, in recognition of its revolutionary potential,” said Srabanti Chowdhury, IEEE IEDM 2022 Publicity Chair, and Associate Professor of Electrical Engineering at Stanford University. “The breakthroughs described at the IEEE-IEDM every year since then have pushed transistor and related technologies forward, enabling the ongoing digital transformation of society. That is why our theme this year is, ‘The 75th Anniversary of the Transistor and the Next Transformative Devices to Address Global Challenges.’”

“In a way, the broad reach, interdisciplinary nature and technical depth of the topics that are featured at the IEEE IEDM serve as a kind of crystal ball showing where the industry is headed,” said Jungwoo Joh, IEEE IEDM 2022 Publicity Vice Chair and Process Development Manager at Texas Instruments. “This year will be no different, with an anticipated technical program of more than 220 presentations, plus many educational opportunities, supplier exhibits, award presentations and other events highlighting the industry’s best work.”

The 2022 Plenary Speakers have been announced:

  • Anne Kelleher, Executive Vice President/General Manager of Technology Development, Intel
  • Yusuke Oike, General Manager, Sony Semiconductor Solutions
  • Maud Vinet, Quantum Hardware Program Manager, CEA-Leti

The special focus session will be held on:

  • Advanced Heterogeneous Integration: Chiplets and System-in-Packaging
  • DNA Digital Data Storage, Transistor-Based DNA Sequencing, and Bio-Computing
  • Emerging Implantable-Device Technology
  • Quantum Information and Sensing
  • Special Topics in Non-Von Neumann Computing

The Sunday short courses will be:

  • ‘High-Performance Technologies for Datacenter and Graphics to Enable Zetta-Scale Computing,’ organized by Ruth Brain, Intel
  • ‘Next-Generation High-Speed Memory,’ organized by Yih Wang, TSMC

The Saturday tutorials will be:

  • ‘Device Innovations to Extend CMOS Scaling for the 2nm Node and Beyond,’ Tenko Yamashita, IBM
  • ‘Sensors for IoT, Automobile, Health and Other,’ Carlotta Guiducci, EPFL
  • ‘Resistive Memories-based Concepts for Neuromorphic Computing,’ Elisa Vianello, CEA-Leti
  • ‘The Era of Advanced Packaging and Hybrid Bonding,’ Sitaram Arkalgud, Tokyo Electron Ltd.
  • ‘FEOL Reliability: from Essentials to Advanced and Emerging Devices and Circuits,’ Ben Kaczer, Imec
  • ‘Fabrication and Three-Dimensional Integration Technologies,’ Qiangfei Xia, University of Massachusetts

For more information, please go to:

Follow the IEEE IEDM via social media

About IEEE & EDS

IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice in a wide variety of areas ranging from aerospace systems, computers, and telecommunications to biomedical engineering, electric power, and consumer electronics. The IEEE Electron Devices Society is dedicated to promoting excellence in the field of electron devices and sponsors the IEDM.

Also read:

3D Device Technology Development

A Crisis in Engineering Education – Where are the Microelectronics Engineers?

Supply Chain Verification: Critical Enabler for Next-Generation Medtech Innovations

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