Alchip Technologies Ltd., a global leader in high-performance computing (HPC) and artificial intelligence (AI) ASIC design and production services, continues its trajectory of rapid growth and technical leadership by pushing the boundaries of advanced-node silicon, expanding its global design capabilities, and building… Read More
Initial thoughts
At IEDM held in December 2024, TSMC presented: “2nm Platform Technology featuring Energy-efficient Nanosheet Transistors and Interconnects co-optimized with 3DIC for AI, HPC and Mobile SoC Applications,” the authors are:
Geoffrey Yeap, S.S. Lin, H.L. Shang, H.C. Lin, Y.C. Peng, M. Wang, PW Wang, CP Lin, KF… Read More
At the VLSI Technology Symposium this week Intel released details on their i3 process. Over the last four nodes Intel has had an interesting process progression. In 2019, 10nm finally entered production with both high performance and high-density standard cells. 10nm went through several iterations eventually resulting in… Read More
Throughout the debate on fab incentives and the Chips Act I keep seeing comments like; TSMC makes >90% of all advanced silicon, or sometimes Taiwan make >90% of all advanced silicon. This kind of ill-defined and grossly inaccurate statement drives me crazy. I just saw someone make that same claim in the SemiWiki forums and… Read More
The majority of EUV production is on 5nm and 3nm node, implemented by late 2022. Metal oxide resists have not been brought into volume production yet [1,2], meaning that only organic chemically amplified resists (CARs) have been used instead until now. These resists have a typical absorption coefficient of 5/um [3,4], which means
For the 2024 SEMI International Strategy Symposium I was challenged by members of the organizing committee to look at where logic will be in ten years from a technology, economics, and sustainability perspective. The following is a discussion of my presentation.
To understand logic, I believe it is useful to understand what makes… Read More
The world is abuzz with 3nm and 2nm technology availability. These processes offer the opportunity to pack far more on a single die than ever before. The complex digital systems contemplated will bring new AI algorithms to life and much more. But there is another side of the technology migration story. With all that digital processing… Read More
News suggests Intel will get 6 of first 10 High NA tools made by ASML in 2024
An industry news source, Trendforce, reports… Read More
As integration levels increase, clock frequencies rise, and feature sizes shrink it is not surprising that all or most aspects of semiconductor design become more complex and demand more from design technologies. One example where the traditional approach is breaking down is in optimizing power distribution networks (PDNs)… Read More
Anyone who has read my previous IEDM articles will know I view it as one of the best conferences on semiconductor process technology. From the tutorials, short courses and the conference papers there are so many great opportunities to keep up to date on the latest developments. The following are the conference organizers’ announcements… Read More
