Key Semiconductor Conferences go Virtual

Key Semiconductor Conferences go Virtual
by Scotten Jones on 06-24-2020 at 2:00 pm

IEDM 2020 Logo

This last week the 2020 Symposia on VLSI Technology and Circuits (VLSI Conference) was held as a virtual conference for the first time and it was announced today (June 24th) that this year’s IEDM conference will also be held as a virtual conference.

“The IEDM Executive Committee has decided that in the interest of prioritizing the… Read More


Effect of Design on Transistor Density

Effect of Design on Transistor Density
by Scotten Jones on 05-26-2020 at 10:00 am

TSMC N7 Density Analysis SemiWiki

I have written a lot of articles looking at leading edge processes and comparing the process density. One comment I often get are that the process density numbers I present do not correlate with the actual transistor density on released products. A lot of people want to draw conclusions an Intel’s processes versus TSMC’s processes… Read More


Cost Analysis of the Proposed TSMC US Fab

Cost Analysis of the Proposed TSMC US Fab
by Scotten Jones on 05-19-2020 at 10:00 am

TSMC US Fab SemiWiki

On May 15th TSMC “announced its intention to build and operate an advanced semiconductor fab in the United States with the mutual understanding and commitment to support from the U.S. federal government and the State of Arizona.”

The fab will run TSMC’s 5nm technology and have a capacity of 20,000 wafers per month (wpm). Construction… Read More


Can TSMC Maintain Their Process Technology Lead

Can TSMC Maintain Their Process Technology Lead
by Scotten Jones on 04-29-2020 at 10:00 am

TSMC Process Lead Slides 20200427 Page 1

Recently Seeking Alpha published an article “Taiwan Semiconductor Manufacturing Company Losing Its Process Leadership To Intel” and Dan Nenni (SemiWiki founder) asked me to take a look at the article and do my own analysis. This is a subject I have followed and published on for many years.

Before I dig into specific process density… Read More


SPIE 2020 – ASML EUV and Inspection Update

SPIE 2020 – ASML EUV and Inspection Update
by Scotten Jones on 04-20-2020 at 10:00 am

0.33 NA EUV systems for HVM Ron Schuurhuis Page 02

I couldn’t attend the SPIE Advanced Lithography Conference this year for personal reasons, but last week Mike Lercel of ASML was nice enough to walk me through the major ASML presentations from the conference.

Introduction
In late 2018, Samsung and TSMC introduced 7nm foundry logic processes with 5 to 7 EUV layers, throughout … Read More


SPIE 2020 – Applied Materials Material-Enabled Patterning

SPIE 2020 – Applied Materials Material-Enabled Patterning
by Scotten Jones on 03-13-2020 at 10:00 am

2020 SPIE Media Briefing Full Slides for Scott Jones Page 16

I wasn’t able to attend the SPIE Advanced Lithography Conference this year for personal reasons, but Applied Materials was kind enough to set up a phone briefing for me with Regina Freed to discuss their Materials-Enabled Patterning announcement.

At IEDM Applied Materials (AMAT) tried to put together a panel across the entire… Read More


LithoVision – Economics in the 3D Era

LithoVision – Economics in the 3D Era
by Scotten Jones on 03-04-2020 at 6:00 am

Slide3

Each year on the Sunday before the SPIE Advanced Lithography Conference, Nikon holds their LithoVision event. This year I had the privilege of being invited to speak for the third consecutive year, unfortunately, the event had to be canceled due to concerns over the COVID-19 virus but by the time the event was canceled I had already… Read More


IEDM 2019 – Imec Interviews

IEDM 2019 – Imec Interviews
by Scotten Jones on 01-21-2020 at 6:00 am

Slide4

Imec is one of the premier semiconductor research organizations and at IEDM they presented dozens of papers. I had the opportunity to see several of the papers presented and interview 3 of Imec’s researchers.

Jan Van Houdt, DMTS ferroelectric and exploratory memory

I have had very interesting discussions with Imec researchers… Read More


IEDM 2019 – IBM and Leti

IEDM 2019 – IBM and Leti
by Scotten Jones on 01-08-2020 at 6:00 am

Slide3

IBM and Leti each presented several papers at IEDM including a joint nanosheet paper. I had the opportunity to sit down with Huiming Bu, director of advanced logic & memory tech and Veeraraghavan Basker, senior engineer from IBM and then in a separate interview Francois Andrieu, head of advanced CMOS laboratory and Shay Reboh,… Read More


IEDM 2019 – Applied Materials panel EUV Recap

IEDM 2019 – Applied Materials panel EUV Recap
by Scotten Jones on 12-23-2019 at 10:00 am

On Tuesday night of IEDM, Applied Materials held a panel discussion “The Future of Logic: EUV is Here, Now What?”. The panelists were: Regina Freed, managing director at Applied Materials as the moderator, Geoffrey Yeap, senior director of advanced technology at TSMC, Bala Haran, director of silicon process research at IBM, … Read More