Anyone who has read my previous IEDM articles will know I view it as one of the best conferences on semiconductor process technology. From the tutorials, short courses and the conference papers there are so many great opportunities to keep up to date on the latest developments. The following are the conference organizers’ announcements… Read More
Up until last December I was president and owner of IC Knowledge LLC, at the end of November, I sold IC Knowledge LLC to TechInsights. It has been interesting to become an insider at the world’s leading semiconductor reverse engineering and knowledge company. The latest SMIC N+2 analysis is an excellent example of TechInsight’s… Read More
At SEMICON West I had a chance to catch up with Mike Lercel of ASML. In this article I am going to combine ASML presentation material from the SPIE Advanced Lithography Conference, Mike’s SEMICON presentation, my discussions with Mike at SEMICON and a few items from ASML’s recent earnings call.
ASML continues to improve DUV systems.… Read More
Intel held a webinar today to discuss their IDM2.0 internal foundry model. On the call were Dave Zinsner Executive Vice President and Chief Financial Officer and Jason Grebe Corporate Vice President and General Manager of the Corporate Planning Group.
On a humorous note, the person moderating the attendee questions sounded … Read More
At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.
Traditionally all interconnects have taken place on the front side of devices with signal and … Read More
On May 22nd Applied Materials announced a new development center, Equipment and Process Innovation and Commercialization Center (EPIC).
Applied Materials already operates the Maydan Technology Center (MTC), a billion-dollar development facility with over 120 advanced process tools and 80 metrology and inspection tools… Read More
The SPIE Advanced Lithography Conference was held in February. I recently had the opportunity to interview Steven Scheer, vice president of advanced patterning process and materials at imec and review selected papers that imec presented.
I asked Steve what the overarching message was at SPIE this year, he said readiness for … Read More
Up until November of 2022, IC Knowledge LLC was an independent company and had become the world leader in cost and price modeling of semiconductors. In November 2022 TechInsights acquired IC Knowledge LLC and IC Knowledge LLC is now a TechInsights company.
For many years, IC Knowledge has published a database tracking all the 300mm… Read More
The SPIE Advanced Lithography Conference is the semiconductor industries premier conference on lithography. The 2023 conference was held the week of February 27th and at the conference Applied Materials announced their Sculpta® pattern shaping tool. Last week I had an opportunity to interview Steven Sherman the Managing … Read More
Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on 2D Materials and TSMC presented 6 papers. Clearly 2D materials are of great interest at least to two of the three leading edge logic companies. Before diving into the papers, some background context is needed.… Read More