At the VLSI Technology Symposium Imec presented on Buried Power Rails (BPR) and Backside Power Delivery (BSPD) in a paper entitled: “Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails”. I recently had a chance to interview one of the authors, Naoto Horiguchi about the work. I have interviewed … Read More
Author: Scotten Jones
Imec Buried Power Rail and Backside Power Delivery at VLSI
ASML EUV Update at SPIE
At the 2022 SPIE Advanced Lithography Conference, ASML presented an update on EUV. I recently had a chance to go over the presentations with Mike Lercel of ASML. The following is a summary of our discussions.
0.33 NA
The 0.33 NA EUV systems are the production workhorse systems for leading edge lithography today. 0.33 NA systems are… Read More
Intel 4 Deep Dive
As I previously wrote about here, Intel is presenting their Intel 4 process at the VLSI Technology conference. Last Wednesday Bernhard Sell (Ben) from Intel gave the press a briefing on the process and provided us with early access to the paper (embargoed until Sunday 6/12).
“Intel 4 CMOS Technology Featuring Advanced FinFET Transistors… Read More
Intel to present Intel 4 process at the VLSI Technology Symposium
The VLSI Symposium on Technology & Circuits will be held in Hawaii from June 12th to June 17th. You can register for the conference here.
The tip sheet for the conference has been released and one thing that caught my eye is some data from the Intel 4 paper that Intel will be presenting at the conference.
Intel’s old roadmap had 14nm,… Read More
The Lost Opportunity for 450mm
I spent several days this week at the SEMI International Strategy Symposium (ISS). One of the talks was “Can the Semiconductor Industry Reach $1T by 2030” given by Bob Johnson of Gartner. His conclusion was, that $1 trillion dollars is an aggressive forecast for 2030 but certainly we should reach $1 trillion dollars in the next 10… Read More
Intel and the EUV Shortage
In my “The EUV Divide and Intel Foundry Services” article available here, I discussed the looming EUV shortage. Two days ago, Intel announced their first EUV tool installed at their new Fab 34 in Ireland is a tool they moved from Oregon. This is another indication of the scarcity of EUV tools.
I have been tracking EUV system production… Read More
Can Intel Catch TSMC in 2025?
At the ISS conference held from April 4th through 6th I presented on who I thought would have the leading logic technology in 2025. The following is a write up of that presentation.
ISS was a virtual conference in 2021 and I presented on who currently had logic leadership and declared TSMC the clear leader. Following that conference,… Read More
The EUV Divide and Intel Foundry Services
The EUV Divide
I was recently updating an analysis I did last year that looked at EUV system supply and demand, while doing this I started thinking about Intel and their Fab portfolio.
If you look at Intel’s history as a microprocessor manufacturer, they are typically ramping up their newest process node (n), in volume production… Read More
Intel 2022 Investor Meeting
Last Thursday Intel held their investors meeting, in this write up I wanted to focus on my areas of coverage/expertise, process technology and manufacturing.
Technology Development presented by Ann Kelleher
Last year Intel presented their Intel Accelerated plan and, in this meeting, we got a review of where Intel stands on that… Read More
Samsung Keynote at IEDM
Kinam Kim is a longtime Samsung technologist who has published many excellent articles over the years. He is now the Chairman of Samsung Electronics, and he gave a very interesting keynote address at IEDM.
He began with some general observations:
The world is experiencing a transformation powered by semiconductors that has been… Read More
Chip War without Soldiers