IEDM 2019 – Imec Interviews

IEDM 2019 – Imec Interviews
by Scotten Jones on 01-21-2020 at 6:00 am

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Imec is one of the premier semiconductor research organizations and at IEDM they presented dozens of papers. I had the opportunity to see several of the papers presented and interview 3 of Imec’s researchers.

Jan Van Houdt, DMTS ferroelectric and exploratory memory

I have had very interesting discussions with Imec researchers… Read More


IEDM 2019 – IBM and Leti

IEDM 2019 – IBM and Leti
by Scotten Jones on 01-08-2020 at 6:00 am

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IBM and Leti each presented several papers at IEDM including a joint nanosheet paper. I had the opportunity to sit down with Huiming Bu, director of advanced logic & memory tech and Veeraraghavan Basker, senior engineer from IBM and then in a separate interview Francois Andrieu, head of advanced CMOS laboratory and Shay Reboh,… Read More


IEDM 2019 – Applied Materials panel EUV Recap

IEDM 2019 – Applied Materials panel EUV Recap
by Scotten Jones on 12-23-2019 at 10:00 am

On Tuesday night of IEDM, Applied Materials held a panel discussion “The Future of Logic: EUV is Here, Now What?”. The panelists were: Regina Freed, managing director at Applied Materials as the moderator, Geoffrey Yeap, senior director of advanced technology at TSMC, Bala Haran, director of silicon process research at IBM, … Read More


IEDM 2019 – TSMC 5nm Process

IEDM 2019 – TSMC 5nm Process
by Scotten Jones on 12-16-2019 at 10:00 am

IEDM is in my opinion the premiere conference for information on state-of-the-art semiconductor processes. In “My Top Three Reasons to Attend IEDM 2019” article I singled out the TSMC 5nm paper as a key reason to attend.

IEDM is one of the best organized conferences I attend and as soon as you pick up your badge you are handed a memory… Read More


Could TSMC’s spend be part of the seasonal pattern?

Could TSMC’s spend be part of the seasonal pattern?
by Robert Maire on 11-25-2019 at 5:00 am

Is there more downside than upside in stocks?
Entering a seasonally weak period, then what?
Does China trade come back to haunt industry?
Cycle is past the bottom-But what kind of up cycle?

The most recent up cycle in the industry was a huge one, driven by a huge spend on NAND as SSD’s sucked up infinite number of devices. DRAM … Read More


IEDM 2019 to Highlight Innovative Devices for an Era of Connected Intelligence

IEDM 2019 to Highlight Innovative Devices for an Era of Connected Intelligence
by Scotten Jones on 08-28-2019 at 6:00 am

The IEEE International Electron Devices Meeting is in my opinion the leading technology conference to understand the current state-of-the-art in semiconductor process technology. Held each year in early December in San Francisco it is a must attend conference for anyone following technology development. The following is… Read More


SEMICON West 2019 – Day 1 – Imec

SEMICON West 2019 – Day 1 – Imec
by Scotten Jones on 07-15-2019 at 10:00 am

On Monday, July 8th Imec held a technology forum ahead of Semicon West. I saw the papers presented and interviewed three of the authors. The following is a summary of what I feel are the keys points of their research.

Arnaud Furnemont
Arnaud Furnemont’s talk was titled “From Technology Scaling to System Optimization”. Simple 2D … Read More


TSMC and Samsung 5nm Comparison

TSMC and Samsung 5nm Comparison
by Scotten Jones on 05-03-2019 at 7:00 am

Samsung and TSMC have both made recent disclosures about their 5nm process and I though it would be a good time to look at what we know about them and compare the two processes.

A lot of what has been announced about 5nm is in comparison to 7nm so we will first review 7nm.

7nm
Figure 1 compares Samsung’s 7LPP process to TSMC’s 7FF and 7FFP… Read More


SPIE Advanced Lithography Conference – Imec and Veeco on EUV

SPIE Advanced Lithography Conference – Imec and Veeco on EUV
by Scotten Jones on 04-19-2019 at 12:00 pm

At the SPIE Advanced Lithography Conference Imec presented several papers on EUV and Veeco presented about etching for EUV masks. I had the opportunity to see the presentations and speak with some of the authors. In this article I will summarize the key issues around EUV based on this research.

EUV is ramping up into high volume 7nm… Read More


SPIE Advanced Lithography Conference – ASML EUV Update

SPIE Advanced Lithography Conference – ASML EUV Update
by Scotten Jones on 03-23-2019 at 12:00 am

At the SPIE Advanced Lithography Conference ASML gave an update on both the current 0.33NA system and the 0.55 high-NA system development. I saw the presentations and got to sit down with Mike Lercel (Director of Strategic Marketing).… Read More