There is a lot of interest right now in how Intel compares to the leading foundries and what the future may hold.
Several years ago, I published several extremely popular articles converting processes from various companies to “Equivalent Nodes” (EN). Nodes were at one time based on actual physical features of processes but had… Read More
I was asked to give a talk at the 2021 ISS conference and the following is a write up of the talk.
The title of the talk is “Logic Leadership in the PPAC era”.
The talk is broken up into three main sections:
- Background information explaining PPAC and Standard Cells.
- A node-by-node comparisons of companies running leading edge logic
… Read More
As I have discussed before, I believe that IEDM is the premier technical conference for understanding leading edge process technologies. Beginning this coming weekend, this year’s edition of IEDM will be held virtually, and I highly recommend attending.
The conference held a press briefing last Monday. The tutorial and short… Read More
Seeking Alpha just published an article about Intel and Samsung passing TSMC for process leadership. The Intel part seems to be a theme with them, they have talked in the past about how Intel does bigger density improvements with each generation than the foundries but forget that the foundries are doing 5 nodes in the time it takes… Read More
I have seen several articles recently discussing foundry wafer selling prices for leading edge wafers, these articles all quote estimates from a paper by the Center for Security and Emerging Technology (CSET). The paper is available here.
My company IC Knowledge LLC is the world leader in cost and price modeling of semiconductors… Read More
TSMC’s Open Innovation Platform’s main objective is to create and promote partnership for producing chips. This year’s OIP event included a presentation on the joint efforts of Silicon Creations, Mentor, a Siemens business and TSMC to produce essential PLL IP for 5nm and 3nm designs. The relentless push for smaller geometries… Read More
For the 10nm – 5nm nodes, the leading-edge foundries are designing cells which utilize 6 or 7 metal tracks, entailing a wide metal line for every 4 or 5 minimum width lines, respectively (Figure 1).
Figure 1. Left: a 7-track cell. Right: a 6-track cell.
This is a fundamental vulnerability for lithography, as defocus can change… Read More
At SEMICON West, Applied Materials announced a new selective gap fill tool to address the growing resistance issues in interconnect at small dimensions. I had the opportunity to discuss this new tool and the applications for it with Zhebo Chen global product manager in the Metal Deposition Products group at Applied Materials.… Read More
The 2020 VLSI Technology Symposium was held as a virtual conference from June 14th through June 19th. At the symposium Imec gave an interesting paper on Buried Power Rails (BPR) and I had a chance to interview one of the authors, Anshul Gupta.
As logic devices continue to scale down metal pitch is reaching a limit. Imec defines a pitch… Read More
The 5nm foundry (e.g., TSMC) node may see the introduction of 6-track cells (two double-width rails plus four minimum-width dense lines) with a minimum metal pitch in the neighborhood of 30 nm. IMEC had studied a representative case as its ‘7nm’ case . TSMC had some published 5nm test structures which looked like… Read More