The 2020 VLSI Technology Symposium was held as a virtual conference from June 14th through June 19th. At the symposium Imec gave an interesting paper on Buried Power Rails (BPR) and I had a chance to interview one of the authors, Anshul Gupta.
As logic devices continue to scale down metal pitch is reaching a limit. Imec defines a pitch… Read More
The 5nm foundry (e.g., TSMC) node may see the introduction of 6-track cells (two double-width rails plus four minimum-width dense lines) with a minimum metal pitch in the neighborhood of 30 nm. IMEC had studied a representative case as its ‘7nm’ case [1]. TSMC had some published 5nm test structures which looked like… Read More
TSMC pushing out equipment purchases
Covid/China trickles down to chip industry
SIA and SEMI ask for financial/govt help to keep up
The beginning of another down cycle?
We have heard from a number of sources that TSMC has started to push out equipment orders as concerns grow about the second half of the year.
Right now is the most logical… Read More
On May 15th TSMC “announced its intention to build and operate an advanced semiconductor fab in the United States with the mutual understanding and commitment to support from the U.S. federal government and the State of Arizona.”
The fab will run TSMC’s 5nm technology and have a capacity of 20,000 wafers per month (wpm). Construction… Read More
Recently Seeking Alpha published an article “Taiwan Semiconductor Manufacturing Company Losing Its Process Leadership To Intel” and Dan Nenni (SemiWiki founder) asked me to take a look at the article and do my own analysis. This is a subject I have followed and published on for many years.
Before I dig into specific process density… Read More
I couldn’t attend the SPIE Advanced Lithography Conference this year for personal reasons, but last week Mike Lercel of ASML was nice enough to walk me through the major ASML presentations from the conference.
Introduction
In late 2018, Samsung and TSMC introduced 7nm foundry logic processes with 5 to 7 EUV layers, throughout … Read More
Each year on the Sunday before the SPIE Advanced Lithography Conference, Nikon holds their LithoVision event. This year I had the privilege of being invited to speak for the third consecutive year, unfortunately, the event had to be canceled due to concerns over the COVID-19 virus but by the time the event was canceled I had already… Read More
Imec is one of the premier semiconductor research organizations and at IEDM they presented dozens of papers. I had the opportunity to see several of the papers presented and interview 3 of Imec’s researchers.
Jan Van Houdt, DMTS ferroelectric and exploratory memory
I have had very interesting discussions with Imec researchers… Read More
IBM and Leti each presented several papers at IEDM including a joint nanosheet paper. I had the opportunity to sit down with Huiming Bu, director of advanced logic & memory tech and Veeraraghavan Basker, senior engineer from IBM and then in a separate interview Francois Andrieu, head of advanced CMOS laboratory and Shay Reboh,… Read More
On Tuesday night of IEDM, Applied Materials held a panel discussion “The Future of Logic: EUV is Here, Now What?”. The panelists were: Regina Freed, managing director at Applied Materials as the moderator, Geoffrey Yeap, senior director of advanced technology at TSMC, Bala Haran, director of silicon process research at IBM, … Read More
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