Webinar: ACEPACK™ SMIT, the power conversion kit

Discover how to simplify overall design and increase power density in your next automotive or industrial power conversion application with ST’s latest surface-mount packages with top-side cooling.

As the performance of a semiconductor device depends on its temperature, how it behaves can vary substantially depending on its package’s construction and how it’s mounted on a circuit board (PCB). To ensure that a chip’s performance complies with its specifications, and to avoid failure, it is very important to correctly manage the transfer of heat between the chip and its environment.

Compared to standard surface-mount packages, power modules in SMD packages with top-side cooling offer a smaller form factor, better thermal performance, and higher design flexibility. ACEPACK SMIT power modules feature a direct bonded copper (DBC) ceramic substrate that enables various electrical circuit solutions from single-switch to multi-die topologies in the 1 to 50 kW power range. This means that the power module, which is directly mounted on the surface of the circuit board (PCB), can be directly connected to an external heatsink to ensure the maximum power dissipation and optimize thermal performance. Moreover, this enables the PCB-module-heat sink stack to be automatically assembled, ensuring a lower profile and more cost-effective production.

Its epoxy molding compound offers outstanding resistance to moisture and heat for automotive and industrial applications. With its low thermal resistance, low electrical parasitic inductance, and outstanding resistance to moisture, the ACEPACK SMIT is an ideal solution for more reliable, high-efficiency power designs at a faster time-to-market.

Agenda

• Introduction to ACEPACK SMIT power modules
• ACEPACK SMIT vs discrete
• Technologies and topology overview
• Applications examples and summary