Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

Overview

Join us to fully understand the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems.  Learn how the Cadence Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff​.

Takeaways:

• Seamless integration with Cadence’s OrbitIO™ Interconnect Designer and Voltus™ IC Power Integrity Solution
• Flexible thermal and stress analysis for TSV and 3D-IC planning
• High performance and accurate thermal and stress analysis for signoff

Date and Time

Tuesday, June 1, 2021
Time: 10:00 BST / 11:00 CEST / 12:00 EEST and IDT / 14:30 IST