EPEPS 2023

The Design and Analysis Frontier for Electronic Packaging

32nd Conference on Electrical Performance of Electronic Packaging and Systems

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave Theory and Techniques Society, and IEEE Antenna and Propagation Society.

REGISTER HERE