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ECTC is now a Free Virtual Conference
June 3 - July 7Free
The Electronics, Components and Technology Conference (ECTC) is the premier international packaging conference. Now through July 7th, you will have free access to more than 400 presentations featuring an outstanding array of packaging technology, including all aspects of advanced packaging: wafer-level and fanout packaging, 3D/TSV, interposers, assembly, materials, modeling, interconnections, reliability, wire bonding, and optoelectronic technologies.
The Program Includes:
45 Technical Sessions
Technical sessions covering all aspects of advanced packaging: wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, organic and Si interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high speed and high bandwidth, photonics, flexible and printed electronics.
Innovative Heterogeneous Integration Technologies Initiate a New Semiconductor Era
Speaker: Douglas Yu – Taiwan Semiconductor Manufacturing Company
In the supply chain for IC, which follows the path of Moore’s Law with system-on-chip, packaging technology used to play mainly a protection role. Chip scaling is becoming more challenging and, at the same time, integration of more functions such as memory, sensors and passives, as well as other components for new applications such as AI and 5G, etc. is required. Innovative heterogeneous integration technologies are being proposed for system-on-package to provide critical Performance, Power and Area (PPA) values for the micro-systems. New, far-reaching changes are being made, which initiate an exciting new semiconductor era and create a new industry landscape.
2020 ECTC Special Session: Bridge to Quantum Computing
Session Chairs: Nicholas Bronn – IBM Research and Pavel Roy Paladhi – IBM Systems
Photonics Special Session: Cutting-Edge Technology on Integrated Photonics and Packaging
Session Chairs: Rena Huang – Rensselaer Polytechnic Institute and Harry Kellzi – Micropac Industries
Plenary Session: 3DIC: Past, Present and Future
Session Chair: Michael Mayer – University of Waterloo
IEEE EPS Seminar: Future Semiconductor Packages for Artificial Intelligence Hardware
Session Chairs: Yasumitsu Orii – Nagase, Japan and Shigenori Aoki – Lintec
Heterogeneous Integration Roadmapping Workshop
Moderators: William Chen – ASE, Bill Bottoms – 3MT Solutions, and Ravi Mahajan – Intel Corporation
ECTC/ITherm Diversity and Career Growth Panel: Diversity and Inclusion Drives Innovation and Productivity
Session Chairs: Kitty Pearsall – Boss Precision, Inc. and Cristina Amon – University of Toronto