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ECTC is now a Free Virtual Conference

June 3, 2020 - July 7, 2020


The Electronics, Components and Technology Conference (ECTC) is the premier international packaging conference. Now through July 7th, you will have free access to more than 400 presentations featuring an outstanding array of packaging technology, including all aspects of advanced packaging: wafer-level and fanout packaging, 3D/TSV, interposers, assembly, materials, modeling, interconnections, reliability, wire bonding, and optoelectronic technologies.

The Program Includes:

 45 Technical Sessions

Technical sessions covering all aspects of advanced packaging: wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, organic and Si interposers, advanced substrate, assembly, materials modeling, reliability, interconnections, packaging for high speed and high bandwidth, photonics, flexible and printed electronics.

ECTC Keynote

Innovative Heterogeneous Integration Technologies Initiate a New Semiconductor Era

Speaker: Douglas Yu – Taiwan Semiconductor Manufacturing Company

In the supply chain for IC, which follows the path of Moore’s Law with system-on-chip, packaging technology used to play mainly a protection role. Chip scaling is becoming more challenging and, at the same time, integration of more functions such as memory, sensors and passives, as well as other components for new applications such as AI and 5G, etc. is required. Innovative heterogeneous integration technologies are being proposed for system-on-package to provide critical Performance, Power and Area (PPA) values for the micro-systems. New, far-reaching changes are being made, which initiate an exciting new semiconductor era and create a new industry landscape.

2020 ECTC Special Session:    Bridge to Quantum Computing

Session Chairs:  Nicholas Bronn – IBM Research and Pavel Roy Paladhi – IBM Systems

Photonics Special Session: Cutting-Edge Technology on Integrated Photonics and Packaging

Session Chairs:  Rena Huang – Rensselaer Polytechnic Institute and Harry Kellzi – Micropac Industries

Plenary Session:   3DIC: Past, Present and Future

Session Chair:   Michael Mayer – University of Waterloo

IEEE EPS Seminar:  Future Semiconductor Packages for Artificial Intelligence Hardware

Session Chairs:  Yasumitsu Orii – Nagase, Japan and Shigenori Aoki – Lintec

Heterogeneous Integration Roadmapping Workshop

Moderators: William Chen – ASE, Bill Bottoms – 3MT Solutions, and Ravi Mahajan – Intel Corporation

ECTC/ITherm Diversity and Career Growth Panel: Diversity and Inclusion Drives Innovation and Productivity

Session Chairs:  Kitty Pearsall – Boss Precision, Inc. and Cristina Amon – University of Toronto


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June 3, 2020
July 7, 2020