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Chiplet Summit 2024

February 6 - February 8

cropped Chiplet Logo

About the Event

The Second Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive.

They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power, and be more flexible.

This unique event gives attendees a place to network with peers, ask questions of the experts, and talk to vendors offering a wide variety of products and services.

Keynote Speakers

Subi Kengeri – Applied Materials

Nitza Basoco – proteanTecs

Daniel Armbrust – Silicon Catalyst

Bob Brennan – Intel Foundry Services

Sheng Lu – Corigine

Cliff Grossner – Open Compute Project

Bapi Vinnakota  Open Compute Project

Central Topics at Chiplet Summit:

  • Application Areas/Use Cases
  • Development Platforms
  • Optimization
  • Architectures
  • Packaging, Integration, and Test

Thought-Provoking Panels Where Attendees Can Ask Questions of Leading Experts:

  • Choosing the Right Architecture for Your Application
  • Next Great Breakthrough in Chiplets
  • Best Development Platform for Chiplets
  • Best Interface for Chiplets
  • What Standards Are Needed?
  • Optimizing Chiplets


Engineers and managers who are looking for ways to help meet performance challenges, handle the move to smaller dimensions, provide the modularity and scalability today’s chips require, and develop solutions focused on the latest applications and interfaces.  Designers of enterprise networks, telecom systems, high-performance computing, financial systems, IoT, and mil/aero applications all know that chiplets will play a big role in their future.


Chiplets improve chip yields and costs, but still provide the performance of a large monolithic chip.  Designers can mix-and-match chiplets, use the process technologies best suited to particular functions, take advantage of chiplet IP, simplify moves to new process nodes,  and avoid wafer waste and manufacturing defects.  Chiplets are the key to producing the extremely high-density, high-performance chips required for today’s networking, storage, AI/ML, analytics, media processing, HPC, and virtual reality applications.


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February 6
February 8
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Santa Clara Convention Center
5001 Great America Pkwy
Santa Clara, CA United States
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