Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023

Highlights:

• Ansys CTO Prith Banerjee will be delivering the Visionary Speaker opening address on Tuesday 11^th
• There will be technical presentations every hour in the Ansys Booth Theater (#1539)
• Get yourself a complimentary sit-down breakfast and a discussion on automotive electronics by registering for the Ansys DAC Breakfast Panel on Tuesday morning
• Register for some of the very limited seating at Ansys’ Customer Workshops with 3 technical tracks
• Ansys customers have contributed over 22 technical papers to the DAC conference Engineering Track

In just a couple of weeks the 2023 Design Automation Conference and Exhibit will start on July 9^th – 13^th in San Francisco, and Ansys will be attending in full force. Ansys’ chief technology officer, Prith Banerjee, has been honored with an invitation to deliver the Visionary Speaker address at the opening of the conference on Tuesday morning. Prith will be sharing his insights on “Driving Engineering Simulation and Design with AI/ML” and the lessons of Ansys incorporating artificial intelligence and machine learning capabilities with its products.

The Ansys 40×40 booth (#1539) is one of the larger ones in this year’s Exhibit, with its major theme on latest multiphysics technology for 2.5D/3D-IC signoff. This includes Thermal Integrity, Electromagnetic Signal Integrity, and Structural Reliability (stress/warpage). The technology for multi-die, heterogeneous integration has been advancing by leaps and bounds as the semiconductor industry moves to this new design paradigm. Presentations on this and other topics are scheduled every hour in the Ansys DAC Booth Theater for any DAC attendee to sit down and ask questions of the experts presenting. Two information stations will be available for self-guided browsing through the full range of Ansys technology offerings or to engage with any of the Ansys support specialists standing by. Ansys is also sponsoring the Community Connection Zone (#1551) right next door to the Ansys booth where people can sit down, take a break, and relax with a coffee or a bite to eat.

The second theme at this year’s Ansys booth responds to the heightened customer interest around Automotive Electronics. The automotive sector is undergoing tectonic changes as manufacturers rush to adapt to 3 fundamental drivers of innovation: electrification of the power train, autonomous driving, and the over-the-air connected vehicle.  Each of these forces are increasing the electronic and semiconductor content in future vehicles. This aligns with Ansys’ deep and broad set of Automotive solutions; from high performance compute (HPC) chips for AI/ML algorithms, to battery management, mechanical reliability, crash test simulation, lighting, and more.

This year’s edition of the traditional Ansys DAC Breakfast Panel will dive more deeply into the Automotive theme. This event serves a full complimentary breakfast to attendees who register for the panel discussion in the Marriott Marquis on Tuesday July 11^th at 7:00am – 8:30am (room Golden Gate B). The topic of this year’s panel discussion is “Driving Design Excellence: The Future of Automotive Electronics”. The discussion will be moderated by Ansys senior chief technologist for automotive Judy Curran who has over 30 years of experience in the automotive industry. A roster of panelists from Rivian, Intel, Synopsys and more. Attendees must register for the Breakfast Event at the Ansys DAC webpage.

The impressively broad usage of Ansys products across the semiconductor industry has once again enabled Ansys customers to submit an equally impressive 22 technical papers that have been accepted by the DAC Conference and will be presented in the Engineering Track. In addition, Ansys product specialist Lang Lin will be joined by researchers from the University of Kobe and the University of Maryland to deliver a tutorial on “Side-Channel Analysis: from Concepts to Simulation and Silicon Validation” on Monday afternoon.

Ansys is organizing a series of technical Customer Workshops in the Ansys Booth conference room. The workshops are 2-hour sessions organized into several tracks where several Ansys customers present detailed technical summaries of their experiences and successes in applying Ansys technology for their production designs. The seating for these valuable workshops is extremely limited and you must reserve your seat as early as possible.

Finally, Ansys is fully engaged with the many discussions and panels that make DAC the valuable must-go event of the year:

• John Lee, VP & GM of Electronics, Semiconductor, and Optics is joining the panel discussion on “Best of Both Worlds: Bridging the Gap Between EDA, System, and Manufacturing”
• Prith Banerjee, CTO is participating in “Designing Effective Autonomous Systems and Digital Twins”
• Larry Williams, Distinguished Engineer will be contributing to “Is Systems Engineering the Solution to the Limits of Dennard Scaling and Moore’s Law?”
• Murat Becer, VP of R&D will be speaking to “Are We There Yet? From Cloud-compatible to Cloud-optimized”
• Norman Chang, Ansys Fellow will be joining the panel on “Packaging and Manufacturing Technologies Save the Day!”

So please make sure to register to attend the conference and join Ansys at DAC. Register for one of our exclusive events or schedule a meeting as we reach out to our customers and partners in advancing the state-of-the-art in Electronic Design Automation.

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