Cadence Dives Deeper at Linley Fall Processor Conference

Cadence Dives Deeper at Linley Fall Processor Conference
by Randy Smith on 11-05-2019 at 10:00 am

I wrote about Cadence AI IP not long ago when I covered the Cadence Automotive Summit at the end of July (Tensilica DNA 100 Brings the AI Inference Solution for Level 2 ADAS ECUs and Level 4 Autonomous Driving, Tensilica HiFi DSPs for What I Want to Hear, and What I Don’t Want to Hear). One of those two blogs remains one of my most widely … Read More


BittWare PCIe server card employs high throughput AI/ML optimized 7nm FPGA

BittWare PCIe server card employs high throughput AI/ML optimized 7nm FPGA
by Tom Simon on 10-31-2019 at 6:00 am

Back in May I wrote an article on the new Speedster7t from Achronix. This chip brings together Network on Chip (NoC) interconnect, high speed Ethernet and memory connections, and processing elements optimized for AI/ML. Speedster7t is a very exciting new FPGA that can be used effectively to accelerate a wide range of processing… Read More


DAC 2020 – Call for Contributions

DAC 2020 – Call for Contributions
by Daniel Payne on 10-28-2019 at 6:00 am

My first DAC was in 1987 so I’ve seen our industry expand greatly over the years, and I expect that #57DAC on July 19-23, 2020 in SFO to be another exciting event to attend for semiconductor professionals from around the globe. What makes DAC so compelling for me to visit are the people, exhibitors, panel discussions, technical… Read More


GLOBALFOUNDRIES and Arm Showcase Broad Range of Partnership

GLOBALFOUNDRIES and Arm Showcase Broad Range of Partnership
by Randy Smith on 10-21-2019 at 10:00 am

I previously blogged on the GLOBALFOUNDRIES (GF) Technology Conference (GTC) held in Santa Clara, CA. The main takeaway that I shared in that blog was that GF’s announced “pivot” to a specialty foundry announced over a year ago, including its decision not to pursue 7nm and smaller nodes, appears to be working and GF is gaining momentum.… Read More


Webinar – AI/ML SoC Memory and Interconnect IP Perspectives

Webinar – AI/ML SoC Memory and Interconnect IP Perspectives
by Tom Simon on 10-08-2019 at 10:00 am

For decades development work on Artificial Intelligence (AI) and Machine Learning (ML) was done on traditional CPUs and memory configurations. Now that we are in the “hockey stick” upturn in deployment of AI and ML, the search is on for the most efficient types of processing architectures. The result is a wave of development for… Read More


The GF Pivot, Specialization Defined

The GF Pivot, Specialization Defined
by Randy Smith on 10-04-2019 at 6:00 am

On August 27, 2018, GLOBALFOUNDRIES (GF) announced that they were no longer going to compete in the race to the next smaller semiconductor node, at that time, the 7nm node. While surprising to some, on further analysis this move made sense. TSMC had announced its plan to invest around $25B in the 5nm technology node. GF revenue is … Read More


AI Hardware Summit, Report #3: Enabling On-Device Intelligence

AI Hardware Summit, Report #3: Enabling On-Device Intelligence
by Randy Smith on 10-03-2019 at 6:00 am

This is the third and final blog I have written about the recent AI Hardware Summit held at the Computer History Museum in Mountain View, CA. Day 1 of the conference was more about solutions in the data center, whereas Day 2 was primarily around solutions at the Edge. This presentation from Day 2 was given by Dr. Thomas Anderson, Head,… Read More


AI Hardware Summit, Report #2: Lowering Power at the Edge with HLS

AI Hardware Summit, Report #2: Lowering Power at the Edge with HLS
by Randy Smith on 09-30-2019 at 10:00 am

I previously wrote a blog about a session from Day 1 of the AI Hardware Summit at the Computer History Museum in Mountain View, CA, held just last week. From Day 2, I want to delve into this presentation by Bryan Bowyer, Director of Engineering, Digital Design & Implementation Solutions Division at Mentor, a Siemens Business.… Read More


eSilicon Brings a New Software Interface to its 7nm neuASIC Machine Learning Platform at Hot Chips

eSilicon Brings a New Software Interface to its 7nm neuASIC Machine Learning Platform at Hot Chips
by Randy Smith on 08-13-2019 at 10:00 am

In early May of this year, eSilicon announced the tape-out of a test chip which included the latest additions to its neuASIC™ IP platform. At the upcoming Hot Chips Symposium to be held at Stanford on August 19 and 20, 2019, eSilicon will be demonstrating the software component of this AI-enabling IP platform. At the event, eSilicon… Read More


The Implications of the Rise of AI/ML in the Cloud

The Implications of the Rise of AI/ML in the Cloud
by Randy Smith on 06-14-2019 at 10:00 am

Recently, Daniel Nenni blogged on the presentation Wally Rhines gave at #56th DAC. Daniel provided a great summary, but I want to dive into a portion of the presentation in more detail. I love Wally’s presentations, but sometimes you cannot absorb the wealth of information he provides when you initially see it. It’s… Read More