Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023

Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023
by Daniel Nenni on 06-26-2023 at 10:00 am

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Highlights:

  • Ansys CTO Prith Banerjee will be delivering the Visionary Speaker opening address on Tuesday 11th
  • There will be technical presentations every hour in the Ansys Booth Theater (#1539)
  • Get yourself a complimentary sit-down breakfast and a discussion on automotive electronics by registering for the Ansys DAC
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Webinar: An AI/ML Driven High-Level Synthesis Solution

Webinar: An AI/ML Driven High-Level Synthesis Solution
by Admin on 06-20-2023 at 4:16 pm

High-Level Synthesis (HLS) tools yield better PPA when the “right set” of optimization constraints and tool settings are applied. Determining the right set of constraints and settings requires design and tool experience and exploration. AI/ML technology has proven highly effective at exploring the solution… Read More


Webinar: Optimality Intelligent System Explorer: Applying AI/ML Technology for Rapid Design Optimization

Webinar: Optimality Intelligent System Explorer: Applying AI/ML Technology for Rapid Design Optimization
by Admin on 06-08-2023 at 9:48 pm

Date: Wednesday, June 21, 2023

Time: 10:00am PT | 1:00pm ET

The problem of optimization is a long-standing one in the field of design. For years, the most conventional approach was the brute-force method of running parametric sweeps on the design space. However, as systems become more complex and the number of parameters increases,… Read More


Chiplet Q&A with John Lee of Ansys

Chiplet Q&A with John Lee of Ansys
by Daniel Nenni on 05-19-2023 at 6:00 am

SNUG Panel

At the recent Synopsys Users Group Meeting (SNUG) I had the honor of leading a panel of experts on the topic of chiplets. One of those panelists was John Lee, Head of Electronics, Semiconductors and Optics at Ansys.

How is the signoff flow evolving and what is being done to help mitigate the growing signoff complexity challenge?

With… Read More


Pushing Acceleration to the Edge

Pushing Acceleration to the Edge
by Dave Bursky on 11-04-2022 at 6:00 am

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As more AI applications turn to edge computing to reduce latencies, the need for more computational performance at the edge continues to increase. However, commodity compute engines don’t have enough compute power or are too power-hungry to meet the needs of edge systems. Thus, when designing AI accelerators for the edge, Joe… Read More


The Increasing Gap between Semiconductor Companies and their Customers

The Increasing Gap between Semiconductor Companies and their Customers
by Rahul Razdan on 10-19-2022 at 6:00 am

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Semiconductors sit at the heart of the electronics revolution, and the scaling enabled by Moore’s law has had a transformational impact on electronics as well as society.   Traditionally, the relationship between semiconductor companies and their customers has been a function of the volume driven by the customer.  In very … Read More


Webinar: Introducing AI/ML into Aerostructures

Webinar: Introducing AI/ML into Aerostructures
by Admin on 10-10-2022 at 2:31 pm

Aerospace belongs to explorers. We have been instrumental in pioneering innovative and complex technologies — and now, new methods fuse with old for entirely new processes that take us further than ever into the beyond.

In four 30-minute sessions, you will learn everything you need to know to begin implementing optimization… Read More


The Increasing Gaps in PLM Systems with Handling Electronics

The Increasing Gaps in PLM Systems with Handling Electronics
by Rahul Razdan on 10-10-2022 at 6:00 am

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Product LifeCycle Management (PLM) systems have shown incredible value for integrating the enterprise with a single view of the product design, deployment, maintenance, and end-of-life processes.  PLM systems have traditionally grown from the mechanical design space, and this still forms their strength.

Meanwhile, due… Read More


Machine Learning in the Fab at #59DAC

Machine Learning in the Fab at #59DAC
by Daniel Payne on 09-14-2022 at 8:00 am

Virtual Metrology min

It used to be true that a foundry or fab would create a set of DRC files, provide them to designers, and then the process yield would be acceptable, however if the foundry knows more details about the physical implementation of IC designs then they can improve the yield. Using a digital twin of the design, process and metrology steps… Read More


A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today

A Different Perspective: Ansys’ View on the Central Issues Driving EDA Today
by John Lee on 06-14-2022 at 6:00 am

RedHawk SC uses Ansys SeaScape Big Data Platform Designed for EDA Applications

For the past few decades, System-on-Chip (SoC) has been the gold standard for optimizing the performance and cost of electronic systems. Pulling together practically all of a smartphone’s digital and analog capabilities into a monolithic chip, the mobile application processor serves as a near-perfect example of an SoC. But… Read More