Ansys and Intel Foundry Direct 2024: A Quantum Leap in Innovation

In the dynamic realm of technological innovation, collaborations and partnerships often serve as catalysts for groundbreaking advancements. Continuing along this trajectory, Ansys, a global leader in engineering simulation software, has forged a partnership with Intel Foundry to enable multiphysics chip design. The two companies share the same set of values: a commitment to science and innovation. To further strengthen this unprecedented collaboration, Ansys proudly participated in the Intel Foundry Direct 2024 event that happened on 21^st February in San Jose, USA.

At the event, John Lee, Vice President and General Manager of the Electronics, Semiconductors, and Optics business unit at Ansys, delivered an Executive Keynote address, along with Keynotes from the other Big-4 EDA suppliers: Synopsys, Cadence, and Siemens. Lee started his talk by eloquently discussing the transformative journey of the semiconductor industry and its pervasive influence across diverse sectors such as high-tech, healthcare, and automotive. He emphasized the critical role of semiconductors in meeting the escalating technological demands of the modern world.

In addressing the evolving demands of the modern world, Lee highlighted how current chip design methodologies are insufficient for handling today’s intricate 2.5D/3D-IC designs. Lee identified three primary challenges facing the EDA industry in crafting intricate architectural chip designs: multi-physics, multi-scale, and multi-organizational challenges. He calls these the 3Ms of 2.5D/3D-IC design.

• Multi-physics hurdles arise from novel physical effects that are not within the experience of most monolithic chip designers. Lee gave Thermal Integrity, EM Signal Integrity, and Mechanical/Structural Integrity as examples of new multiphysics challenges.
• Multi-scale challenges manifest due to the blurred boundaries between chip, package, and system design. Multi-die assemblies involve the designer at the nanometer device scale, the micrometer chip layout scale, the millimeter packaging scale, all the way to the cm/m system scale. This multi-scale reality across 6 orders of magnitude means that physical effects fundamentally change how they behave at each level. Thermal was given as a good example of a physical simulation that has very different requirements at the chip, package, and system levels.
• Multi-organizational challenges emanate from the necessity to revamp traditional company structures to align with the demands of contemporary design. This may be the most intractable problem as companies try to fit the physics to the org chart rather than adapting the org chart to match the physics requirements.

Lee suggests that by adopting strategic thinking, the challenges of multi-physics, multi-scale, and multi-organizational aspects can be turned into valuable opportunities. A considered approach is t suggest the three ‘P’s – physics, platforms, and partnerships – as keys to unlocking the complete benefits arising from the transformative shifts in the industry. John Lee highlighted Ansys’ multiphysics broad and mature array of physics simulation solutions, designed to equip designers with the tools necessary to overcome the hurdles of modern chip design.  He stressed the need for the EDA industry to provide open and extensible platforms that allow customers to bring together the best-in-breed solutions from the entire industry and enable these on the cloud.

In a strategic collaboration, Ansys has recently partnered with Intel to deliver multiphysics signoff solutions tailored for Intel’s innovative 2.5D chip assembly technology. Ansys was able to list its products as certified by Intel in supporting their cutting-edge technology for 18A ribbonFETs, Power Vias for backside power delivery, and EMIB (Embedded Multi-die Interconnect Bridge) to establish flexible connections between multiple dies without relying on through-silicon vias (TSVs).

As another example of successful partnership in the EDA industry, John Lee gave the example of the 3-way collaboration between Intel, Synopsys, and Ansys to solve the multiphysics challenge that links IR-drop and timing closure. The joint solution combines golden signoff technology from both companies to deliver IR-STA and IR-ECO integration flow.

The entire event was exciting and high-energy, devoid of any dull moments. Pat Gelsinger, the Chief Executive Officer at Intel, infused the gathering with his visionary outlook for the Intel foundry and a conviction that Moore’s Law is far from dead. He articulated a compelling vision to catapult this iconic company, reinstating its pivotal position in the realm of technology. Gelsinger’s aim was not merely to revitalize Intel but also to spearhead the restoration of Western chip manufacturing on a grand scale. His vision emphasized the creation of a resilient, sustainable, and trusted supply chain, signaling a strategic commitment to a future marked by innovation and reliability.

Over 30 partners, including the ARM, UMC, MediaTek, and Broadcom took part in the Intel Foundry Direct event. Intel orchestrated an outstanding showcase, featuring special speeches from well-known names in the industry such as Sam Altman, Co-founder and CEO of OpenAI, Secretary Gina M. Raimondo, United States Secretary of Commerce, and Satya Nadella, Chairman and Chief Executive Officer of Microsoft.

In conclusion, the event hosted by Intel Foundry stood out as a remarkable gathering, uniting professionals from various sectors of the semiconductor industry to share insights and envision the future. John Lee’s notable presence underscored the robust partnership between Ansys and Intel. As the collaborative efforts between simulation and fabrication continue to evolve, the Ansys-Intel alliance is poised to make a lasting impact on the technological landscape, pushing boundaries and serving as inspiration for the next wave of breakthroughs.

Learn more about the multiphysics analysis and simulation solutions offered by Ansys here: Ansys Semiconductor Solutions | Datasheet

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