I had a chance to catch up with Arun Iyengar, CEO of Untether AI. Untether AI recently unveiled its tsunAImi accelerator cards powered by the company’s runAI devices. Using at-memory computation, Untether AI breaks through the barriers of traditional von Neumann architectures, offering industry-leading compute density … Read More
I was asked to give a talk at the 2021 ISS conference and the following is a write up of the talk.
The title of the talk is “Logic Leadership in the PPAC era”.
The talk is broken up into three main sections:
- Background information explaining PPAC and Standard Cells.
- A node-by-node comparisons of companies running leading edge logic
Of the three types of materials used in microelectronics – i.e., semiconductors, metals, and dielectrics – the first two often get the most attention. Yet, there is a pressing need for a rich variety of dielectric materials in device fabrication and interconnect isolation to satisfy the performance, power, and reliability … Read More
There are significant advances in communication protocols happening all around us. The Peripheral Component Interconnect Express (PCIe) Gen 5 standard is delivering the needed device-to-device performance to support artificial intelligence and machine learning applications as well as cloud-based workloads. The rapidly… Read More
The next transition from current FinFET devices at advanced process nodes is the “nanosheet” device, as depicted in the figure below. 
The FinFET provides improved gate-to-channel electrostatic control compared to a planar device, where the gate traverses three sides of the fin. The “gate-all-around” characteristics… Read More
SemiAnalysis and SkyJuice have teamed up in order to analyze the A14 die shot from ICmasters. Our previous analysis of the A14, delved into why Apple and TSMC have deviated from previous generations when comparing theoretical logic transistor density to a real world utilized transistor density.… Read More
As I have discussed before, I believe that IEDM is the premier technical conference for understanding leading edge process technologies. Beginning this coming weekend, this year’s edition of IEDM will be held virtually, and I highly recommend attending.
The conference held a press briefing last Monday. The tutorial and short… Read More
Bloomberg did an interview with my favorite semiconductor analyst Stacy Rasgon on “How the Number One U.S. Semiconductor Company Stumbled” that I found interesting. Coupled with the Q&A Bob Swan did at the Credit Suisse Annual Technology Conference I thought it would be good content for a viral blog.
Tony Pialis is a visionary entrepreneur focused on developing
technologies for next generation connectivity. In the last twenty 20 years, he has co-founded three semiconductor IP companies, all exclusively targeting connectivity IP. Tony is currently the CEO of Alphawave IP Inc, a leader in delivering multi-standard wireline… Read More
Seeking Alpha just published an article about Intel and Samsung passing TSMC for process leadership. The Intel part seems to be a theme with them, they have talked in the past about how Intel does bigger density improvements with each generation than the foundries but forget that the foundries are doing 5 nodes in the time it takes… Read More