The media has gone wild over a false report that Intel and TSMC are slowing down 3nm. It is all about sensationalism and getting clicks no matter what damage is done to the hardworking semiconductor people, companies and industry as a whole. And like lemmings jumping off a cliff, other less reputable media outlets perpetuated this… Read More
Pinpointing exactly when 450mm died is tricky. Intel’s pullback in 2014 has been cited as a pivotal moment because it was the main backer of the proposed transition, as it had been for the shift to 150mm (6-inch) wafers in the early 1980s.
However, the participation of global foundry leader TSMC was also seen as crucial if 450mm wafers… Read More
-Need more/less spend & more/fewer chips
-The irony of chips act passage & Intel stumble on same day
-Due to excess supply of chips, Intel cuts spending
-Due to shortage of chips, the government increases spending
-How did this happen on the same day? Cosmic Coincidence?
Timing is everything
The irony of intel cutting spending… Read More
The VLSI Symposium on Technology and Circuits provides a deep dive on recent technical advances, as well as a view into the research efforts that will be transitioning to production in the near future. In a short course presentation at the Symposium, Marko Radosavljevic, from the Components Research group at Intel, provided … Read More
Our laptops and desktop computers have billions of transistors in their application processor chips, yet I often don’t consider the reliability effects of aging that the transistors experience in the chips. At the recent Synopsys User Group (aka SNUG), there was a technical presentation on this topic from Srinivas Bodapati,… Read More
As I previously wrote about here, Intel is presenting their Intel 4 process at the VLSI Technology conference. Last Wednesday Bernhard Sell (Ben) from Intel gave the press a briefing on the process and provided us with early access to the paper (embargoed until Sunday 6/12).
“Intel 4 CMOS Technology Featuring Advanced FinFET Transistors… Read More
From initial process technology development (TD) to high volume manufacturing (HVM) status for a new node, one of the key support functions to improve and maintain yield is the in-line wafer inspection technology. Actually, there are multiple inspection technologies commonly employed, with tradeoffs in pixel resolution,… Read More
At the recent SPIE Advanced Lithography + Patterning Conference, Mark Phillips from Intel gave an insightful update on the status of the introduction of the 0.55 high numerical aperture extreme ultraviolet lithography technology. Mark went so far as to assert that the development progress toward high-NA EUV would support … Read More
One of the recent live events I attended was the 2022 GSA Silicon Leadership Summit on May 12th at the Santa Clara Convention Center (my favorite location). This was the first GSA live event in two years so it was a must attend gathering. This event targets semiconductor ecosystem executives (200+ people attended) so there were many… Read More