Highlights of the “Intel Accelerated” Roadmap Presentation

Highlights of the “Intel Accelerated” Roadmap Presentation
by Tom Dillinger on 07-30-2021 at 6:00 am

ribbon FETs

Introduction

Intel recently provided a detailed silicon process and advanced packaging technology roadmap presentation, entitled “Intel Accelerated”.  The roadmap timeline extended out to 2024, with discussions of Intel client, data center, and GPU product releases, and especially, the underlying technologies to be … Read More


Intel’s EMIB Packaging Technology – A Deep Dive

Intel’s EMIB Packaging Technology – A Deep Dive
by Tom Dillinger on 05-03-2021 at 6:00 am

EMIB configurations

The evolution of low-cost heterogeneous multi-chip packaging (MCP) has led to significant system-level product innovations.  Three classes of MCP offerings have emerged:

  • wafer-level fan-out redistribution, using reconstituted wafer substrates of molding compound as the surface for interconnections between die (2D)
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The Coming Tsunami in Multi-chip Packaging

The Coming Tsunami in Multi-chip Packaging
by Tom Dillinger on 07-12-2019 at 6:00 am

The pace of Moore’s Law scaling for monolithic integrated circuit density has abated, due to a combination of fundamental technical challenges and financial considerations.  Yet, from an architectural perspective, the diversity in end product requirements continues to grow.  New heterogeneous processing units are being… Read More