Intel recently provided a detailed silicon process and advanced packaging technology roadmap presentation, entitled “Intel Accelerated”. The roadmap timeline extended out to 2024, with discussions of Intel client, data center, and GPU product releases, and especially, the underlying technologies to be … Read More
The evolution of low-cost heterogeneous multi-chip packaging (MCP) has led to significant system-level product innovations. Three classes of MCP offerings have emerged:
The pace of Moore’s Law scaling for monolithic integrated circuit density has abated, due to a combination of fundamental technical challenges and financial considerations. Yet, from an architectural perspective, the diversity in end product requirements continues to grow. New heterogeneous processing units are being… Read More
