Advanced semiconductor systems are no longer limited by a single engineering domain. They are constrained by the convergence of many interdependent vectors: silicon nodes, advanced packaging architectures, substrate materials, platform PCBs, power-delivery networks, thermal behavior, manufacturing variation, firmware… Read More
As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple chiplets and… Read More
Date: Jun 25, 2026 | 9:00 AM PST
In this webinar, Intel will present how EMIB (Embedded Multi‑die Interconnect Bridge) enables compact, cost-effective multi‑die design while sustaining the bandwidth and power efficiency required for AI and datacenter designs. Intel will share an EMIB reference methodology built on Synopsys
In the rapidly evolving landscape of semiconductor manufacturing, the demand for processors that handle increasing workloads while maintaining power efficiency and compact form factors has never been higher. Intel’s Foveros 2.5D packaging technology emerges as a pivotal innovation, enabling denser die integration… Read More
In an era dominated by artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC), the demand for semiconductors that deliver high data throughput, low latency, and energy efficiency has never been greater. Traditional chip designs often struggle to keep pace with these requirements, leading… Read More
Intel, long a leader in semiconductor manufacturing, is on a determined journey to reclaim its technological leadership in the industry. After facing significant challenges in recent years, the company is making a concerted effort to adapt and innovate, with a clear focus on AI-driven technologies, advanced packaging solutions,… Read More
Artificial intelligence (AI) and machine learning (ML) are evolving at an extraordinary pace, powering advancements across industries. As models grow larger and more sophisticated, they require vast amounts of data to be processed in real-time. This demand puts pressure on the underlying hardware infrastructure, particularly… Read More
In the dynamic realm of technological innovation, collaborations and partnerships often serve as catalysts for groundbreaking advancements. Continuing along this trajectory, Ansys, a global leader in engineering simulation software, has forged a partnership with Intel Foundry to enable multiphysics chip design. The … Read More
Intel recently made headlines when CEO Pat Gelsinger unveiled the world’s first UCIe interoperability test chip demo at Innovation 2023. The test chip built using advanced packaging technology is codenamed Pike Creek and is used to demonstrate interoperability across chiplets designed by Intel and Synopsys. More details … Read More
The trend is undeniable. Highly integrated monolithic chips can no longer handle the demands of next-generation systems. The reasons for this significant shift in design are many. Much has been written on the topic; you can get a good overview of the forces at play in multi-die design here. These changes represent the next chapter… Read More
