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Synopsys RedHawk sc webinar 800x100px
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How Hyperscalers Are Changing the Ethernet Landscape

How Hyperscalers Are Changing the Ethernet Landscape
by Synopsys on 08-17-2021 at 6:00 am

How Hyperscalers Are Changing the Ethernet Landscape

It’s all about bandwidth these days – fueling hyperscale data centers that support high-performance and cloud computing applications. It’s what enables you to stream a movie on your smart TV while your roommate plays an online game with friends located in different parts of the country. It’s what makes big data analytics run swiftly… Read More


Synopsys’ Complete 800G Ethernet Solutions

Synopsys’ Complete 800G Ethernet Solutions
by Kalar Rajendiran on 08-12-2021 at 10:00 am

Evolution of Ethernet Speeds

If I ask the question, “What has grown 4,000x over the last twenty-five years?”, most people will start throwing names of some stocks. Although various stock markets have had crazy run ups and yes, there is a stock that has grown 2,500x over that period of time, the answer to the 4,000x question is not a stock. What if I modify the question… Read More


On-the-Fly Code Checking Catches Bugs Earlier

On-the-Fly Code Checking Catches Bugs Earlier
by Synopsys on 08-10-2021 at 6:00 am

Euclide GUI

There’s no question that chip designs are getting more complex, driven by the power, performance, and area (PPA) demands of applications like artificial intelligence (AI), automotive, and cloud computing. This complexity, of course, trickles down to the design and testbench code. When engineers can find and fix bugs before… Read More


Upcoming Virtual Event: Designing a Time Interleaved ADC for 5G V2X Automotive Applications

Upcoming Virtual Event: Designing a Time Interleaved ADC for 5G V2X Automotive Applications
by Kalar Rajendiran on 08-03-2021 at 10:00 am

Mohammed Ismail Wayne State University

Over the last decade or so, the automotive industry has been rapidly adopting and deploying innovative and revolutionary technologies in automobiles. One such revolution is the autonomous vehicle technology. While this technology is not fully mature yet, some components of this technology are. Many late model automobiles… Read More


Optimize RTL and Software with Fast Power Verification Results for Billion-Gate Designs

Optimize RTL and Software with Fast Power Verification Results for Billion-Gate Designs
by Johannes Stahl on 07-28-2021 at 10:00 am

ZeBu Empower diagram

In every chip, power is a progressive problem to be solved. Designers have long had to rely on a combination of experience and knowledge to tackle this dilemma, typically having to wait until after silicon availability to perform power analysis with realistic software workloads. However, this is too late in the game, as it becomes… Read More


Driving PPA Optimization Across the Cubic Space of 3D IC Silicon Stacks

Driving PPA Optimization Across the Cubic Space of 3D IC Silicon Stacks
by Tom Simon on 07-06-2021 at 9:00 am

Improved PPA Using 3D IC

The move to true 3D IC, monolithic 3D SOC and 3D heterogeneous integration may require one of the most major design tool architecture overhauls since IC design tools were first developed. While we have been taking steps toward 3DIC with 2.5D designs with interposers, HBM, etc., the fundamental tools and flows remain intact in many… Read More


Safety + Security for Automotive SoCs with ASIL B Compliant tRoot HSMs

Safety + Security for Automotive SoCs with ASIL B Compliant tRoot HSMs
by Kalar Rajendiran on 06-30-2021 at 10:00 am

New Architectures Reshaping Auto SoCs

Automotive segment is a market that has historically been supported by a few select suppliers within the semiconductor ecosystem. Over the last decade, this market has transitioned from just being about reliability, performance, fuel efficiency, etc., to placing equal importance to user experience. This user experience … Read More


Die-to-Die Connections Crucial for SOCs built with Chiplets

Die-to-Die Connections Crucial for SOCs built with Chiplets
by Tom Simon on 06-21-2021 at 6:00 am

die to die connections

If you ascribe to the notion that things move in circles, or concentrically, the move to die-to-die connectivity makes complete sense. Just as multi-chip modules (MCM) were the right technology decades ago to improve power, areas, performance and cost, the use of chiplets with die-to-die connections provides many advantages… Read More


IoT’s Inconvenient Truth: IoT Security Is a Never-Ending Battle

IoT’s Inconvenient Truth: IoT Security Is a Never-Ending Battle
by Dana Neustadter on 06-01-2021 at 10:00 am

IoTs Inconvenient Truth IoT Security Is a Never Ending Battle

The continued innovation and widespread adoption of connected devices — the internet of things (IoT) — has resulted in a vast range of conveniences that improve our lives every day. At the same time, the ubiquity of IoT devices, which market watchers estimate to be in the tens of billions, also makes it more attractive to bad actors… Read More


Upping the Safety Game Plan for Automotive SoCs

Upping the Safety Game Plan for Automotive SoCs
by Rich Collins on 05-20-2021 at 10:00 am

Upping the Safety Game Plan for Automotive SoCs

Thanks to advanced hardware and software, smart vehicles are improving with every generation. Capabilities that once seemed far-off and futuristic—from automatic braking to self-driving at the very pinnacle—are now either standard or within reach. However, considering how vehicle architectures have continued to evolve,… Read More