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There is a lot being said about Intel getting the lead back from TSMC with their 18A process. Like anything else in the semiconductor industry there is much more here than meets the eye, absolutely.
From the surface, TSMC has a massive ecosystem and is in the lead as far as process technologies and foundry design starts but Intel is … Read More
For more than 65 years, the IEEE International Electron Devices Meeting (IEDM) has been the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. As I post this, the conference is underway in San Francisco… Read More
The release and scattering of photoelectrons and secondary electrons in EUV resists has often been glossed over in most studies in EUV lithography, despite being a fundamental factor in the image formation. Fortunately, Intel has provided us with a laboriously simulated electron release and scattering model, using the GEANT4… Read More
I confess I am reading tea leaves in this blog, but why not? Arm recently announced Arm Total Design, an expansion of their Compute Subsystems (CSS) offering which made me wonder about the motivation behind this direction. They have a lot of blue-chip partners lined up for this program yet only a general pointer to multi-die systems… Read More
Intel recently issued a press announcement that has significant implications for the future of semiconductors. The release announces Intel’s new glass substrate technology. The headline states: Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules… Read More
Given the changes in the music business, the term “Rock Star” doesn’t really have any relevance to music or its performers anymore. Instead, we use the term to describe leaders, innovators and generally people or organizations of great significance. In the world of semiconductors, the designers of advanced chips were the rock… Read More
The trend is undeniable. Highly integrated monolithic chips can no longer handle the demands of next-generation systems. The reasons for this significant shift in design are many. Much has been written on the topic; you can get a good overview of the forces at play in multi-die design here. These changes represent the next chapter… Read More
Intel held a webinar today to discuss their IDM2.0 internal foundry model. On the call were Dave Zinsner Executive Vice President and Chief Financial Officer and Jason Grebe Corporate Vice President and General Manager of the Corporate Planning Group.
On a humorous note, the person moderating the attendee questions sounded … Read More
(First published December 24, 2014)
A list of the best and worst CEOs in 2014 was recently published. The good news is that none of our semiconductor CEOs were on the worst list. The bad news is that none of our semiconductor CEOs were on the best list either. I will be writing about the CEOs that made our industry what it is today starting… Read More
At the 2023 VLSI Symposium on Technology and Circuits, Intel presented two papers on their PowerVia technology. We received a pre-conference briefing on the technology embargoed until the conference began and received the papers.
Traditionally all interconnects have taken place on the front side of devices with signal and … Read More
Podcast EP284: Current Capabilities and Future Focus at Intel Foundry Services with Kevin O’Buckley
Podcast EP265: The History of Moore’s Law and What Lies Ahead with Intel’s Mr. Transistor
Podcast EP186: The History and Design Impact of Glass Substrates with Intel’s Dr. Rahul Manepalli
Podcast EP153: Suk Lee’s Journey to Intel Foundry Services, with a Look to the Future
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