CAST Compression IP Webinar 800x100 (2)
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Multi-Channel Multi Rate FEC Engine Webinar with Open Silicon

Multi-Channel Multi Rate FEC Engine Webinar with Open Silicon
by Eric Esteve on 11-29-2017 at 12:00 pm

I will be pleased to moderate on December 7[SUP]th[/SUP] the Open-Silicon webinar addressing the benefits of the multi-channel multi-rate forward error correction (MCMR FEC) IP and the role it plays in high-bandwidth networking applications, especially those where the bit error rate is very high, such as high speed SerDes … Read More


Outsourced Operations: Reduced Risk, Fast Ramp, and Managed Complexity

Outsourced Operations: Reduced Risk, Fast Ramp, and Managed Complexity
by Daniel Nenni on 11-29-2017 at 7:00 am

One of the more interesting semiconductor success stories is Apple and how they transformed from a struggling computer company to a dominant chip maker. We covered this story in quite a bit of detail in our book “Mobile Unleashed” in Chapter 7 “From Cupertino” but the short answer to how they did it is: Outsourced Operations.


Apple’s… Read More


Advanced ASICs – It Takes an Ecosystem

Advanced ASICs – It Takes an Ecosystem
by Mike Gianfagna on 11-26-2017 at 2:00 pm

I remember the days of the IDM (integrated device manufacturer). For me, it was RCA, where I worked for 15 years as the company changed from RCA to GE and then ultimately to Harris Semiconductor. It’s a bit of a cliché, but life was simpler then, from a customer point of view at least. RCA did it all. We designed all the IP, did the physical… Read More


Worldwide Interface IP Revenue Grew by 13.5% in 2016 (Source: IPnest)

Worldwide Interface IP Revenue Grew by 13.5% in 2016 (Source: IPnest)
by Eric Esteve on 11-26-2017 at 2:59 am

IPnest has released the 9[SUP]th[/SUP] version of the Interface IP Survey, ranking by protocol the IP vendors addressing the Interface segments: USB, PCI Express, (LP)DDRn, MIPI, Ethernet & SerDes, HDMI/DP and SATA. When the 1[SUP]st[/SUP] version has been issued in 2009, the IP segment was weighting $225 million and the… Read More


Electronics Production Rising in 2017

Electronics Production Rising in 2017
by Bill Jewell on 11-20-2017 at 12:00 pm

Production of electronic equipment is continuing healthy growth. China, the world’s largest producer of electronics, had a three-month-average increase of 14% in October 2017 versus a year ago. Year-to-date through October, China’s electronic production has gained 13.8% compared to 10.0% for the year 2016, putting China… Read More


ASIC and TSMC are the AI Chip Unsung Heroes

ASIC and TSMC are the AI Chip Unsung Heroes
by Daniel Nenni on 11-20-2017 at 7:00 am

One of the more exciting design start market segments that we track is Artificial Intelligence related ASICs. With NVIDIA making billions upon billions of dollars repurposing GPUs as AI engines in the cloud, the Application Specific Integrated Circuit business was sure to follow. Google now has its Tensor Processing Unit, Intel… Read More


New e-Book – Custom SoCs for IoT: Simplified – Available for Free Download

New e-Book – Custom SoCs for IoT: Simplified – Available for Free Download
by Mitch Heins on 11-17-2017 at 12:00 pm

We are fortunate to be living in one of the most amazing and exciting times in the history of our planet. The developments seen in my life time alone have been astounding and we are now on the cusp of yet another inflection point. The world wide web has morphed into the internet of things (IoT), some even call it the internet-of-everything… Read More


Will Broadcom become a Chipzilla or is the deal DOA?

Will Broadcom become a Chipzilla or is the deal DOA?
by Robert Maire on 11-11-2017 at 6:00 am

The Broadcom bid for Qualcomm is the biggest, boldest semiconductor deal to date. Just when we thought semi M&A was cooling off, this deal is a years worth of deals rolled into one. Not only does this deal upset the current balance between chip suppliers and customers, it would create a giant entity smack in the middle of IOT, AI,… Read More


Deep Learning and Cloud Computing Make 7nm Real

Deep Learning and Cloud Computing Make 7nm Real
by Daniel Nenni on 11-05-2017 at 7:00 am

The challenges of 7nm are well documented. Lithography artifacts create exploding design rule complexity, mask costs and cycle time. Noise and crosstalk get harder to deal with, as does timing closure. The types of applications that demand 7nm performance will often introduce HBM memory stacks and 2.5D packaging, and that creates… Read More


Choosing the lesser of 2 evils EUV vs Multi Patterning!

Choosing the lesser of 2 evils EUV vs Multi Patterning!
by Robert Maire on 11-03-2017 at 12:00 pm

For Halloween this week we thought it would be appropriate to talk about things that strike fear into the hearts of semiconductor makers and process engineers toiling away in fabs. Do I want to do multi-patterning with the huge increase in complexity, number of steps, masks and tools or do I want to do EUV with unproven tools, unproven… Read More