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TSMC Technologies for Mobile and HPC

TSMC Technologies for Mobile and HPC
by Alex Tan on 05-10-2018 at 12:00 pm

During TSMC 2018 Technology Symposium, Dr. B.J. Woo, TSMC VP of Business Development presented market trends in the area of mobile applications and HPC computing as well as shared TSMC progress in making breakthrough efforts in the technology offerings to serve these two market segments.

Both 5G and AI are taking the center stage… Read More


Top 10 Highlights of the TSMC 2018 Technology Symposium

Top 10 Highlights of the TSMC 2018 Technology Symposium
by Tom Dillinger on 05-04-2018 at 12:00 pm

Here are the Top 10 highlights from the recent TSMC 2018 Technology Symposium, held in Santa Clara CA. A couple of years ago, TSMC acknowledged the unique requirements of 4 different market segments, which has since guided their process development strategy — Mobile, High-Performance Computing (HPC), Automotive, and… Read More


Leading Edge Logic Landscape 2018

Leading Edge Logic Landscape 2018
by Scotten Jones on 03-16-2018 at 2:00 pm

The most viewed blogs I write for SemiWiki are consistently blogs comparing the four leading edge logic producers, GLOBALFOUNDRIES (GF), Intel, Samsung (SS) and TSMC. Since the last time I compared the leading edge new data has become available and several new processes have been introduced. In this blog I will update the current… Read More


Webinar: Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems

Webinar: Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems
by Bernard Murphy on 02-08-2018 at 7:00 am

In case you missed the TSMC event, ANSYS and TSMC are going to reprise a very important topic – signing-off reliability for ADAS and semi-autonomous /autonomous systems. This topic hasn’t had a lot of media attention amid the glamor and glitz of what might be possible in driverless cars. But it now seems like the cold light of real … Read More


Machine Learning And Design Into 2018 – A Quick Recap

Machine Learning And Design Into 2018 – A Quick Recap
by Alex Tan on 02-07-2018 at 3:00 pm

How could we differentiate between deep learning and machine learning as there are many ways of describing them? A simple definition of these software terms can be found here. Let’s look into Artificial Intelligence (AI), which was coined back in 1956. The term AI can be defined as human intelligence exhibited by machines.Read More


TSMC 5nm and EUV Update 2018

TSMC 5nm and EUV Update 2018
by Daniel Nenni on 01-23-2018 at 12:00 pm

The TSMC Q4 2017 earnings call transcript is up and I found it to be quite interesting for several reasons. First and foremost, this is the last call Chairman Dr. Morris Chang will participate in which signifies the end of a world changing era for me and the fabless semiconductor ecosystem, absolutely. TSMC announced his retirement… Read More


ISS 2018 – The Impact of EUV on the Semiconductor Supply Chain

ISS 2018 – The Impact of EUV on the Semiconductor Supply Chain
by Scotten Jones on 01-18-2018 at 8:00 am

I was invited to give a talk at the ISS conference on the Impact of EUV on the Semiconductor Supply Chain. The ISS conference is an annual gathering of semiconductor executives to review technology and global trends. In this article I will walk through my presentation and conclusions.… Read More


ASIC and TSMC are the AI Chip Unsung Heroes

ASIC and TSMC are the AI Chip Unsung Heroes
by Daniel Nenni on 11-20-2017 at 7:00 am

One of the more exciting design start market segments that we track is Artificial Intelligence related ASICs. With NVIDIA making billions upon billions of dollars repurposing GPUs as AI engines in the cloud, the Application Specific Integrated Circuit business was sure to follow. Google now has its Tensor Processing Unit, Intel… Read More


Choosing the lesser of 2 evils EUV vs Multi Patterning!

Choosing the lesser of 2 evils EUV vs Multi Patterning!
by Robert Maire on 11-03-2017 at 12:00 pm

For Halloween this week we thought it would be appropriate to talk about things that strike fear into the hearts of semiconductor makers and process engineers toiling away in fabs. Do I want to do multi-patterning with the huge increase in complexity, number of steps, masks and tools or do I want to do EUV with unproven tools, unproven… Read More


Arm TechCon Preview with the Foundries!

Arm TechCon Preview with the Foundries!
by Daniel Nenni on 10-23-2017 at 9:00 am

This week Dr. Eric Esteve, Dr. Bernard Murphy, and I will be blogging live from Arm TechCon. It really looks like it will be a great conference so you should see some interesting blogs in the coming days. One of the topics I am interested in this year is foundation IP and I will tell you why.

During the fabless transformation of the semiconductor… Read More