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TSMC continues to reinforce its leadership in advanced semiconductor manufacturing through its deepening collaboration with Cadence Design Systems. The expanded partnership focuses on enabling next-generation artificial intelligence and high-performance computing innovations by aligning advanced electronic design… Read More
The global semiconductor industry sits at the foundation of modern technology, powering everything from smartphones and cloud data centers to artificial intelligence, automobiles, and national defense systems. At the center of advanced chip manufacturing are three major players: TSMC, Samsung Foundry, and Intel Foundry… Read More
The expansion of semiconductor manufacturing in the United States, particularly with TSMC’s multi-fab campus in Phoenix, Arizona, has created a significant need for skilled technical workers. To meet this demand, TSMC has partnered with educational institutions, including Grand Canyon University (GCU), to launch… Read More
NanoIC has announced a major expansion of its process design kit portfolio with the introduction of its first A14 logic and embedded eDRAM memory PDK. This milestone reflects the company’s growing role in enabling advanced semiconductor design at cutting-edge technology nodes and addresses increasing industry demand for… Read More
In February of 2026, Taiwan Semiconductor Manufacturing Company (TSMC) will host the TSMC AZ Exclusive Experience Day in Phoenix, Arizona, offering selected participants a rare opportunity to engage directly with one of the most advanced semiconductor manufacturing organizations in the world. The event will serve as an immersive… Read More
When Morris Chang left Texas Instruments in 1983 to found TSMC, he was not merely starting a new company—he was proposing a new industrial logic. Chang recognized that semiconductor manufacturing had become so capital-intensive that it could no longer survive as just one function inside a vertically integrated company.… Read More
As semiconductor scaling slowed and system performance became increasingly constrained by data movement rather than raw compute, advanced packaging emerged as a decisive lever. Among these technologies, TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) represents a turning point in how high-performance systems are … Read More
In a significant example of how high-tech manufacturing can embrace environmental stewardship without compromising operational excellence, Taiwan Semiconductor Manufacturing Company has launched a sustainability initiative within its advanced packaging operations that both reduces waste and generates meaningful… Read More
Taiwan Semiconductor Manufacturing Company has once again demonstrated its leadership in corporate sustainability with the successful conclusion of its 6th ESG AWARD, which attracted more than 5,800 proposals from employees across the organization. The overwhelming response reflects not only TSMC’s strong internal engagement… Read More
Socionext’s recent run of rapid 3D-IC tape-outs is a noteworthy milestone for the industry with two successful tape-outs in just seven months for complex, multi-die designs aimed at AI and HPC workloads. That pace of iteration highlights how advanced packaging, richer EDA toolchains, and closer foundry-ecosystem collaboration… Read More
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