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TSMC Banner 2023
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TSMC OIP Ecosystem Forum 2026: Spotlight on Emerging Technologies

TSMC OIP Ecosystem Forum 2026: Spotlight on Emerging Technologies
by Mike Gianfagna on 10-02-2026 at 8:00 am

TSMC OIP 2026 Emerging Technologies Alley

 

The TSMC OIP Ecosystem Forum highlighted many accomplishments across TSMC’s vast ecosystem. Specific achievements with TSMC as well as collaborative work across several companies were all on display.

And there was an exhibit area where you could meet the companies behind many of these stories and learn more about them.… Read More


TSMC’s AI Design Kit: Bringing Agentic AI Into Chip Design

TSMC’s AI Design Kit: Bringing Agentic AI Into Chip Design
by Daniel Nenni on 10-01-2026 at 10:00 am

TSMC’s AI Design Kit Bringing Agentic AI Into Chip Design

TSMC is introducing an AI Design Kit, or ADK, to help artificial intelligence tools make better use of its semiconductor manufacturing knowledge. The idea is to give AI agents that run chip-design workflows a technology-specific foundation, so they can adjust designs toward performance, power and area targets with less manual… Read More


TSMC OIP Ecosystem Forum 2026: Broadcom’s View of ASICs and Ecosystems

TSMC OIP Ecosystem Forum 2026: Broadcom’s View of ASICs and Ecosystems
by Mike Gianfagna on 09-30-2026 at 12:00 pm

TSMC OIP Ecosystem Forum 2026 Broadcom’s View of ASICs and Ecosystems

I spent a significant part of my career in the ASIC business. This segment of semiconductors has always been challenging, difficult and invigorating. There is something special about delivering a working custom chip that enables your customer to bring a world-changing product to market. It has always been a highly competitive… Read More


Why Advanced Chip Packaging Is Becoming a Design Problem

Why Advanced Chip Packaging Is Becoming a Design Problem
by Daniel Nenni on 09-29-2026 at 2:00 pm

Why Advanced Chip Packaging Is Becoming a Design Problem

As chipmakers put more computing power into a single system, the challenge extends beyond making individual chips faster. They must connect multiple chips, memory stacks, power supplies, and sometimes optical components in a compact package. In the2026 TSMC OIP Forum talk “Addressing Inter-Die Complexity for 3D Multi-Die… Read More


Siemens and TSMC push AI deeper into chip design

Siemens and TSMC push AI deeper into chip design
by Daniel Nenni on 09-29-2026 at 8:00 am

Siemens and TSMC push AI deeper into chip design

Siemens and TSMC are expanding their collaboration on semiconductor design tools, with a focus on AI assisted workflows, advanced chip packaging and support for newer manufacturing processes. Their announcement centers on an AI agent intended to find and fix design rule violations: errors that can prevent a chip layout from… Read More


TSMC OIP Ecosystem Forum 2026: Opening Remarks

TSMC OIP Ecosystem Forum 2026: Opening Remarks
by Mike Gianfagna on 09-28-2026 at 12:00 pm

TSMC OIP Ecosystem Forum 2026 Opening Remarks

The 2026 TSMC Open Innovation Platform (OIP) Ecosystem Forum was held on September 23, 2026, in Santa Clara, CA. This is the event where TSMC showcases the substantial progress made with its massive semiconductor ecosystem. As one would expect, AI was a key topic throughout the day, with some very impressive results reported and… Read More


Designing chips for the AI era: what TSMC’s roadmap means

Designing chips for the AI era: what TSMC’s roadmap means
by Daniel Nenni on 09-25-2026 at 8:00 am

TSMC LC Lu OIP Event

About twenty years ago I worked with Cliff Hou, LC Lu, and the TSMC PDK team on reference flows with emerging EDA and IP companies. This was the precursor to the OIP. Having a person with LC Lu’s depth of R&D experience running the TSMC Design & Technology Platform is truly an honor, absolutely.

AI is creating two related… Read More


The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems

The Intelligence Revolution: TSMC’s OIP Ecosystem Forges the Path to Trillion-Transistor AI Systems
by Kalar Rajendiran on 09-23-2026 at 2:00 pm

Broadest Portfolio of Silicon Validated IP

At the 2026 OIP Ecosystem Forum, the industry narrative shifted from incremental scaling to what TSMC defines as the “Intelligence Revolution.” Akin to the 18th-century Industrial Revolution which transitioned human physical labor to mechanical power, the current era is augmenting human ingenuity through … Read More


Podcast EP368: An Overview of TSMC Open Innovation Platform (OIP) event with Aveek Sarkar

Podcast EP368: An Overview of TSMC Open Innovation Platform (OIP) event with Aveek Sarkar
by Daniel Nenni on 09-23-2026 at 2:00 pm

Daniel is joined by Aveek Sarkar, who heads TSMC’s Ecosystem and Alliance Management Division. Along with his team, he is responsible for driving semiconductor design enablement in collaboration with the partner ecosystem through TSMC’s Open Innovation Platform® (OIP). Prior to TSMC, Aveek worked on chip designs at Sun Microsystems… Read More


Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L

Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L
by Daniel Nenni on 09-22-2026 at 6:00 am

TSMC CoWos Packaging Comparison

Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC. It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance computing… Read More