TSMC, the world’s largest contract semiconductor manufacturer, is significantly expanding its deployment of NVIDIA artificial intelligence and accelerated computing technologies throughout its chip design and manufacturing operations. The initiative represents one of the most comprehensive applications of AI within… Read More
TSMC Pioneers a New Era in AI-Powered Trade Secret Management, Achieving Intelligent Innovation
As semiconductor manufacturing becomes increasingly knowledge-intensive, protecting intellectual property and trade secrets has emerged as a strategic imperative. The world’s leading foundry, TSMC is advancing beyond conventional information security practices by integrating artificial intelligence into… Read More
TSMC Powers Up: 408,000 Batteries Get a Safety Intelligence Upgrade
As semiconductor manufacturing becomes increasingly dependent on uninterrupted power and energy efficiency, battery reliability has emerged as a critical operational issue for advanced fabs. Taiwan Semiconductor Manufacturing Company, better known as TSMC, is addressing this challenge through an ambitious global initiative… Read More
ASML High-NA EUV is Not Ready for High-Volume Production
Contrary to the popular press, ASML High-NA EUV is not ready for logic production yet—and it may never be, at least not in the form originally envisioned. If you remember how long it took conventional EUV to become production-worthy—arguably 5–10 years—this should not come as a surprise. More importantly, this is no longer just… Read More
Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC
At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More
imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling
imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More
TSMC’s Record Tool Orders Hint at Another CapEx Shockwave
TSMC’s latest Board of Directors capital appropriation announcement may appear mixed on the surface, but a closer look reveals one important conclusion: The company is quietly setting the stage for another potential upward revision to its already aggressive 2026 capital expenditure outlook. The headline figure of $31.3B … Read More
Dr. L.C. Lu on TSMC Advanced Technology Design Solutions
L.C. leads efforts in design enablement, ensuring that the company can meet the diverse and evolving requirements of its global customer base. Prior to this, he headed the Design and Technology Platform organization starting in 2018.
Since joining TSMC in 2000, Dr. Lu has held multiple leadership positions in design services.… Read More
Dr. Y.J. Mii on TSMC Technology Leadership in 2026
Dr. Y.J. Mii joined TSMC in 1994 as a manager at Fab 3 before moving into the company’s research and development organization in 2001. He was appointed Vice President of R&D in 2011 and later advanced to Senior Vice President in November 2016.
Over more than 20 years at TSMC, Dr. Mii has played a central role in advancing and manufacturing… Read More
Enabling Next-Generation AI Through Advanced Packaging and 3D Fabric Integration
The rapid rise of artificial intelligence is fundamentally reshaping computing architectures. As AI models scale toward trillions of parameters, traditional approaches to performance improvement are no longer sufficient. Instead, the industry is entering a new era where system-level innovation, advanced packaging, … Read More

