hip webinar automating integration workflow 800x100 (1)
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No EUV before 7nm?

No EUV before 7nm?
by Paul McLellan on 02-07-2013 at 1:31 pm

I was at the Common Platform Technology Forum this week. One of the most interesting sessions is IBM’s Gary Patton giving an overview of the state of semiconductor fabrication. Then, at lunchtime, he is one of the people that the press can question. In this post, I’m going to focus on Extreme Ultra-Violet (EUV) lithography.… Read More


Using Soft IP and Not Getting Burned

Using Soft IP and Not Getting Burned
by Daniel Payne on 02-07-2013 at 10:11 am

The most exciting EDA + Semi IP company that I ever worked at was Silicon Compilers in the 1980’s because it allowed you to start with a concept then implement to physical layout using a library of parameterized IP, the big problem was verifying that all of the IP combinations were in fact correct. Speed forward to today and our… Read More


Common Platform Technology Forum February 5th 2013 Live or Online!

Common Platform Technology Forum February 5th 2013 Live or Online!
by Daniel Nenni on 02-03-2013 at 8:00 am

Can’t make it to Santa Clara? Join us online!

The detailed 2013 CPTF agenda is now up in preparation for the February 5th event at the Santa Clara Convention Center. This is one of the rare times that you can get a free lunch! Watch this quick video to see what is in store for us this year. Dr. Paul McLellan and I will be there so please… Read More


Advanced Technology-Design-Manufacturing Co-optimization

Advanced Technology-Design-Manufacturing Co-optimization
by Daniel Nenni on 01-31-2013 at 7:00 pm

I spent some quality time with Subi Kengeri, Vice President, Technology Architecture, Office of the CTO, GLOBALFOUNDRIES in Las Vegas during CES. Great guy, he worked at Silicon Access, Virage and TSMC before GF. One thing you should know about embedded memory guys, SRAM is the first thing that goes through a new process so they … Read More


How GLOBALFOUNDRIES is Differentiating in 2013

How GLOBALFOUNDRIES is Differentiating in 2013
by Daniel Nenni on 01-27-2013 at 7:00 pm

GLOBALFOUNDRIES changed the landscape of the foundry business in 2009 with a simple but ambitious plan to become the world’s first truly global foundry. At the Common Platform Technology Forum February 5th in the Santa Clara Convention Center GF Executive Vice President Michael Noonen will give an update on how that is … Read More


Cadence, Synopsys, and Mentor on FinFETs

Cadence, Synopsys, and Mentor on FinFETs
by Daniel Nenni on 01-27-2013 at 7:00 pm

In my opinion, FinFETs will be the most significant piece of technology we, as semiconductor ecosystem people, will experience this decade. Seriously this is exciting stuff and one of the top search terms on SemiWiki for 6 months running. Here is a quick peek at what the top EDA companies will be talking about at the Common PlatformRead More


FD-SOI is Worth More Than Two Cores

FD-SOI is Worth More Than Two Cores
by Paul McLellan on 01-20-2013 at 10:00 pm

This is the second blog entry about an ST Ericsson white-paper on multiprocessors in mobile. The first part was here.

The first part of the white-paper basically shows that for mobile the optimal number of cores is two. It is much better to use process technology (and good EDA) to run the processor at higher frequency rather than add… Read More


Wall Street Does NOT Know Semiconductors!

Wall Street Does NOT Know Semiconductors!
by Daniel Nenni on 01-20-2013 at 6:00 pm

In my never ending quest to promote the fabless semiconductor ecosystem I cannot pass up a discouraging word about one of the oldest financial services companies. You can consult with me for $300 per hour to answer your questions about the semiconductor industry on the phone or you can buy me lunch and get it in person (lunch will probably… Read More


Mentor @ the TSMC Open Innovation Platform Forum

Mentor @ the TSMC Open Innovation Platform Forum
by glforte on 01-16-2013 at 6:16 pm

At TSMC’s Open Innovation Platform (OIP) Ecosystem Forum, Mentor made technical presentations on four different topics, two of them co-presented with TSMC and LSI Corporation. Those presentations are described below with links to downloadable pdf presentation files.

Finding and Fixing Double Patterning Errors in
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The First 14nm FinFET Wafer Sighting!

The First 14nm FinFET Wafer Sighting!
by Daniel Nenni on 01-11-2013 at 12:10 pm

Incredibly exciting! Even my beautiful wife was impressed by the rainbow of colors it reflected. From left to right: 28nm, 20nm, and 14nm wafers. The 20nm and 14nm wafers are from the GLOBALFOUNDRIES NY fab, made in the USA! GF also announced another $3-4B CAPEX for 2013 to increase capacity of all three of their 300mm fabs (Singapore,… Read More