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Intel’s big investor day was anything but big. The stock reacted poorly, down 5% on a day that was a widespread sell-off anyways.
I want to briefly summarize what matters for the stock. There was very little incremental news to the technology roadmap, and the financial outlook was underwhelming, to say the least.
Last Thursday Intel held their investors meeting, in this write up I wanted to focus on my areas of coverage/expertise, process technology and manufacturing.
Technology Development presented by Ann Kelleher
Last year Intel presented their Intel Accelerated plan and, in this meeting, we got a review of where Intel stands on that… Read More
Exciting times for the semiconductor industry! Last week Intel announced a billion dollar fund to build a foundry ecosystem and today Intel announced they are acquiring foundry Tower Semiconductor for $5.6 billion dollars, WOW! Some people doubted Intel’s commitment to the foundry market this time. I think we can now put that… Read More
At the recent Intel Architecture Day presentations, a breadth of roadmap plans were provided – an earlier article focused on the x86 client and data center cores and products. This article focuses on the GPU and IPU announcements.
Xe Graphics Core
The Intel GPU architecture for embedded, discrete, and data center… Read More
The optimization of computing throughput, data security, power efficiency, and total cost of ownership is an effort that involves managing interdependencies between silicon and packaging technologies, architecture, and software. We often tend to focus on the technology, yet the architecture and software… Read More
One of the career Intel employees (33+ years) that Pat Gelsinger brought back is Stuart Pann. Stuart is now the Senior Vice President of the Intel Corporate Planning Group. He does not have direct foundry experience but he certainly knows Intel and Pat so it will be interesting to see where this goes.
The big fake news last week came from a report out of China stating that TSMC won a big Intel order for 3nm wafers. We have been talking about this for some time on SemiWiki so this is nothing new. Unfortunately, the article mentioned wafer and delivery date estimates that are unconfirmed and from what I know, completely out of line. … Read More
Intel recently provided a detailed silicon process and advanced packaging technology roadmap presentation, entitled “Intel Accelerated”. The roadmap timeline extended out to 2024, with discussions of Intel client, data center, and GPU product releases, and especially, the underlying technologies to be … Read More
Intel presented yesterday on their plans for process technology and packaging over the next several years. This was the most detailed roadmap Intel has ever laid out. In this write up I will analyze Intel’s process announcement and how they match up with their competitors.
10nm Super Fin (SF)
10nm is now in volume production in three… Read More