Defacto Technologies is a company that specializes in Electronic Design Automation (EDA) software and solutions. Defacto offers a range of EDA software solutions that help streamline and optimize various stages of the front-end design process. Their tools focus on chip design assembly and integration before logic synthesis
A preview of Weebit Nano at DAC – with commentary from ChatGPT
Weebit Nano, a provider of advanced non-volatile memory (NVM) IP, will be exhibiting at the Design Automation Conference (DAC) this month. As part of this briefing I shared some of the basic the details with ChatGPT to see how it would phrase things. Here is some of what it suggested: “You won’t want to miss out on the epic experience… Read More
Unique IO & ESD Solutions @ DAC 2023!
The semiconductor industry continues to drive innovation and constantly seeks methods to lower costs and improve performance. The advantages of custom I/O libraries versus free libraries can be seen as cost-savings or, more importantly, new markets, new customers, and new business
opportunities.
At DAC 2023, Certus Semiconductor… Read More
Samsung Foundry on Track for 2nm Production in 2025
On the heels of the TSMC Symposium and the Intel Foundry update, Samsung held their Foundry Forum today live in Silicon Valley. As usual it was a well attended event with hundreds of people and dozens of ecosystem partners. The theme was the AI Era which is appropriate. As I have mentioned before, AI will touch most every chip and there… Read More
Ansys Revving up for Automotive and 3D-IC Multiphysics Signoff at DAC 2023
Highlights:
- Ansys CTO Prith Banerjee will be delivering the Visionary Speaker opening address on Tuesday 11th
- There will be technical presentations every hour in the Ansys Booth Theater (#1539)
- Get yourself a complimentary sit-down breakfast and a discussion on automotive electronics by registering for the Ansys DAC
Assessing EUV Wafer Output: 2019-2022
At the 2023 SPIE Advanced Lithography and Patterning conference, ASML presented an update on its EUV lithography systems in the field [1]. The EUV wafer exposure output was presented and is shown below in table form:
From this information, we can attempt to extract and assess the EUV wafer output per quarter. First, since there … Read More
Efabless Celebrates AI Design Challenge Winners!
The first AI Generated Open-Source Silicon Design Challenge invited participants to use generative AI to design an open-source silicon chip and tape it out in just three weeks. The contestants were required to create Verilog code from natural language prompts, and then implemented their designs using the chipIgnite platform… Read More
Intel Internal Foundry Model Webinar
Intel held a webinar today to discuss their IDM2.0 internal foundry model. On the call were Dave Zinsner Executive Vice President and Chief Financial Officer and Jason Grebe Corporate Vice President and General Manager of the Corporate Planning Group.
On a humorous note, the person moderating the attendee questions sounded … Read More
Keynote Sneak Peek: Ansys CEO Ajei Gopal at Samsung SAFE Forum 2023
As one of the world’s leading chip foundries, Samsung occupies a vital position in the semiconductor value chain. The annual Samsung Advanced Foundry Ecosystem (SAFE™) Forum is a must-go event for semiconductor and electronic design automation (EDA) professionals. Ajei Gopal, President and CEO of Ansys, has the honor of delivering… Read More
WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC Design Technology
In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using Through Silicon Vias (TSVs) or hybrid bonding.
The 2.5D-IC design method places multiple chiplets alongside each other on a silicon interposer. Microbumps and interconnect… Read More


The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival