Network-on-Chip (NoC) is an emerging paradigm for communications within large VLSI systems implemented on a single silicon chip. Sgroi et al. call “the layered-stack approach to the design of the on-chip intercore communications the Network-on-Chip (NOC) methodology.” In a NoC system, modules such as processor… Read More
Electronic Design Automation
Reducing the Need for Guardbanding Flash ADC Designs
Flash analog-to-digital converters (ADCs) are commonly used in high-frequency applications such as satellite communications, sampling oscilloscopes, and radar detection. Flash ADC is preferred over other ADC architectures because it is extremely fast and quite simple. However, flash ADC typically requires twice as many… Read More
David Liu, Kauffmann Award winner
David Liu receeived the Kaufman award for 2001 at the Kaufman award dinner a few weeks ago.
Or to be more formal about it:Dr. C. L. David Liu, the William Mong honorary chair professor of Computer Science and former president of the National Tsing Hua University in Hsinchu, Taiwan, will be presented with this year’s Phil Kaufman Award… Read More
Multi-Mode Simulation – What’s New at Cadence?
Every week I receive several webinar invitations, so the recent one from Cadence about Virtuoso Multi-Mode simulation caught my fancy because I had met with John Pierce at DAC and wanted to see what was new since then and see how they compared with Mentor and Synopsys tools.
John Pierce, Product Marketing Director
This webinar runs… Read More
The Power of the Platform!
The Nintendo Wii is one of the most successful gaming platforms with the most diverse set of games — from fun games that can be enjoyed by the whole family to fitness programs that can be used by adults. They beat the dominant Sony Playstation and the Microsoft Xbox by thinking outside the box and creating a platform that was really… Read More
Formally verifying protocols
I attended much of the Jasper users’ group a week ago. There were several interesting presentations that I can’t just blog about because companies are shy, and some that would only be of interest if you were a user of Jasper’s products on a daily basis.
But for me the most interesting presentations were several… Read More
Physical Verification of 3D-IC Designs using TSVs
3D-IC design has become a popular discussion topic in the past few years because of the integration benefits and potential cost savings, so I wanted to learn more about how the DRC and LVS flows were being adapted. My first stop was the Global Semiconductor Alliance web site where I found a presentation about how DRC and LVS flows were… Read More
EDA Interoperability Forum
The 24th Interoperability Forum is coming up at the end of the month on November 30th to be held at the Synopsys compus in Mountain View. It lasts from 9am until lunch (and yes, Virginia, there is such a thing as a free lunch). I think it looks like a very interesting way to spend a morning.
Here are the speakers and what they are speaking… Read More
Synopsys Awarded TSMC’s Interface IP Partner of the Year
Is it surprising to see that Synopsys has been selected Interface IP partner of the year by TSMC? Not really, as the company is the clear leader on this IP market segment (which includes USB, PCI Express, SATA, DDRn, HDMI, MIPI and others protocols like Ethernet, DisplayPort, Hyper Transport, Infiniband, Serial RapidIO…). But,… Read More
RTL Power Models
One of the challenges of doing a design in the 28nm world is that everything depends on everything else. But some decisions need to be made early with imperfect information. But the better the information we have, the better those early decisions will be. One area of particular importance is selecting a package, designing a power… Read More
Why NA is Not Relevant to Resolution in EUV Lithography