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Will 3DIC Ever Be Cheap Enough for High Volume Products?

Will 3DIC Ever Be Cheap Enough for High Volume Products?
by Paul McLellan on 12-12-2014 at 8:00 pm

More news from the 3DASIP conference. Chet Palesko of SavanSys Solution had an interesting presentation with the same title as this blog (although this blog draws from several other presentations too). Chet took a look at what aspects of 3D are likely to get cheaper going forward. He took as a starting point that stuff that is not … Read More


Benefits of Using Schematic Driven Layout

Benefits of Using Schematic Driven Layout
by Daniel Payne on 12-12-2014 at 12:00 pm

Most IC designs are developed by a team of professionals, often separated into distinct groups like front-end and back-end, logical and physical designers. Circuit designers use tools like schematic capture at the transistor-level to create a topology, then begin simulating the netlist with a SPICE simulator. Layout designers… Read More


A Functional Verification Framework Spanning Simulation to Emulation

A Functional Verification Framework Spanning Simulation to Emulation
by Daniel Payne on 12-11-2014 at 2:00 am

Software engineers and firmware designers can find bugs, update their code and re-distribute to the users. In the consumer electronics world this means that my smart phone apps get updated, and my Android OS gets updated on a somewhat regular basis, however on the hardware side the design and verification of an SoC must be close … Read More


Intel has Another First for 14nm Production!

Intel has Another First for 14nm Production!
by Daniel Nenni on 12-10-2014 at 7:00 am

An interesting thing happened while I was researching a slide from Bill Holt’s “Advancing Moore’s Law” presentation at last month’s analyst meeting. Slide #19 mentioned that Intel was the first to use “air gap” dielectric spaces to improve performance in a digital logic flow for microprocessors. I know a certain foundry that … Read More


CTO Interview with Dr. Wim Schoenmaker of Magwel

CTO Interview with Dr. Wim Schoenmaker of Magwel
by Daniel Payne on 12-09-2014 at 7:00 pm

I visited the Magwel booth at DAC in June and chatted with Dundar Dumlugol the CEO about their EDA tools that enable 3D co-simulation and extraction. Since then I’ve made contact with their CTO, Dr. Wim Schoenmaker to better understand what it’s like to start up and run an EDA company. Magwel’s history goes back… Read More


Synthesizing rad-tolerant RTL for FPGAs

Synthesizing rad-tolerant RTL for FPGAs
by Don Dingee on 12-09-2014 at 4:00 pm

The maiden voyage of NASA’s Orion spacecraft brought a raft of articles about how the flight computer inside is “no smarter than your phone,” running on wheezing IBM PowerPC 750FX processors. NASA’s deputy manager for Orion avionics, Matt Lemke, admits the configuration is already obsolete – at least in commercial terms. … Read More


Synopsys Q4 Earnings

Synopsys Q4 Earnings
by Paul McLellan on 12-06-2014 at 11:02 am

Synopsys announced their earnings a couple of days ago. This is actually also the end of their fiscal year. They had quarterly earnings of $539M meaning that they did just over $2B for the year. Their guidance for fiscal 2015 is revenue between $2.185B to $2.225B. They said that about 80% of that revenue is already in backlog.

But it… Read More


Variation at IEDM

Variation at IEDM
by Paul McLellan on 12-05-2014 at 7:01 am

IEDM (technically the International Electron Devices Meeting although I’ve never heard anyone use the full name) is in a couple of weeks time, in San Francisco. It is December 15-17th at the Hilton Union Square (which is not actually at Union Square but nearby at 333 O’Farrell Street).

For the last few years on the Tuesday… Read More


HLS – Major Improvement through Generations

HLS – Major Improvement through Generations
by Pawan Fangaria on 12-02-2014 at 6:30 pm

I am a believer of continuous improvement in anything we do; it’s pleasant to see rapid innovation in technology these days, especially in semiconductor space – technology, design, tools, methodologies… Imagine a 100K gates up to 1M gates design running at a few hundred MHz frequency and at technology node in the range of .18 to … Read More


Design Rule Checking (DRC) Meets New Challenges

Design Rule Checking (DRC) Meets New Challenges
by Daniel Payne on 12-02-2014 at 7:00 am

The traditional batch-oriented DRC process run as a final check to ensure compliance with foundry yield goals is quickly moving toward a concurrent DRC process performed early and often throughout design, especially at the 28 nm and smaller process nodes. What are the technology factors causing this change?

  • Increasing number
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