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In case you missed it earlier this year, Mentor Graphics the oldest EDA brand officially changed its name to Siemens EDA and launched a new website under its parent Siemens Digital Industries Software.
Under Siemens Digital Industries Software, Siemens EDA adds IC, advanced IC packaging and PCB systems design, verification/validation… Read More
Artificial intelligence (AI) algorithms thirsting for higher performance per watt have driven the development of specific hardware design techniques, including in-memory computing, for system-on-chip (SoC) designs. In-memory computing has predominantly been publicly seen in semiconductor startups looking to disrupt… Read More
An unavoidable consequence of getting older is that more frequently our friends and colleagues unexpectedly leave us for their final venture. Jim Hogan, widely known and loved in the semiconductor industry, has passed on. He will leave a substantial hole in the hearts of many. Always ready with seasoned advice, a sympathetic … Read More
For years, there have been rather distinct domains for the extraction of interconnect models from physical design data.
Chip designers commonly focused on RC parasitics for circuit/path delay calculations and dynamic I*R voltage drop analysis. The annotation of extracted parasitics to a netlist model required the layout… Read More
RK has over 25 years of industry experience in the domain of Telecom, Embedded software and Semiconductors. Before co-founding Vayavya, he was a co-founder at Smart Yantra Technologies, where he has held various positions in engineering, marketing and management. At Vayavya RK is responsible for overall management and strategic… Read More
HCL VersionVault is a secure enterprise solution for version control and configuration management. With HCL VersionVault – Cadence Virtuoso Integration, VersionVault brings its enterprise configuration management capabilities to analog and mixed signal designers. This integration enables designers to take advantage… Read More
IDC has forecasted that over the next five years, the Global Datasphere — the amount of data that’s created, transferred over the network and stored each year — will increase by over 3X to 175 zettabytes (Figure 1). Much of this is driven by the Internet of Things (IoT), video applications (including video streaming,… Read More
Paul Cunningham, CVP and GM of the System Verification Group at Cadence gave the afternoon Keynote on Tuesday at DVCon and doubled down on his verification-throughput message. At the end of the day, what matters most to us in verification is the number of bugs found and fixed per dollar per day. You can’t really argue with that message.… Read More
Despite sounding like a minor enhancement version for USB, USB 3.2 introduces many important changes for the USB specification. To see where USB has come from and where it is going, it is essential to look at what is found in USB 3.2. The other salient point is that now the Type-C connector has split out from the underlying USB specification… Read More
The emergence of advanced packaging technologies has led to the introduction of new types of data communication interfaces. There are a number of topologies that are defined by the IEEE 802.3 standard, as well as the Optical Internetworking Common Electrical I/O CEI standard. [1,2] (Many of the configurations of interest … Read More
TSMC CoWoS versus Intel EMIB Semiconductor Packaging