Integrated wafer-level fanout (WLFO) packaging technology is emerging as a foundation for multi-die solutions. Mobile product applications require focus on both aggressive chip-to-chip interface performance, as well as the final package volume. Traditional multi-chip packages using PCB laminate substrates do not readily… Read More
Custom layout productivity requires unrelenting EDA vendor focus
The EDA tools industry relies upon ongoing productivity enhancements to existing products, to manage increasing SoC complexity and to address shrinking design schedules. The source of ideas for enhancements can come from a variety of sources – e.g., customer feedback, collaboration with the foundries, and features found … Read More
Formally Crossing the Chasm
Formal verification for hardware was stuck for a long time with a reputation of being interesting but difficult to use and consequently limited to niche applications. Jasper worked hard to change this, particularly with their apps for JasperGold and I have been seeing more anecdotal information that mainstream adoption is growing.… Read More
IC Designers talk about 28nm to 7nm challenges at #53DAC
IC design challenges are different at advanced nodes like 7nm, so to learn more about the topic I attended a panel luncheon at DAC sponsored by Cadence. The moderator was both funny and technically astute, quite the rare combination, so kudos to Professor Rob Rutenbar, a former Neolinear guy now at the University of Illinois. Panelists… Read More
Climbing the Infinite Verification Mountain
Many years ago I read a great little book by Rudy Rucker called “Infinity and the Mind”. This book attempts to explain the many classes of mathematical infinity (cardinals) to non-specialists. As he gets to the more abstract levels of infinity, the author has to resort to an analogy to give a feel for extendible and other cardinal … Read More
Six Reasons to Visit Cadence at #53DAC this Year in Austin
For bloggers like myself spending four days at #53DAC is almost a non-stop blur of activity, visiting EDA vendors, IP providers and foundries to learn about what’s happening in our semiconductor industry. Cadence is both an EDA vendor and IP provider, so DAC is a great showcase for them to tell us what’s new in 2016 and… Read More
Getting Low Power Design Right in Mixed Signal Designs
Mixed-signal design creates all sorts of interesting problems for implementation and verification flows, particularly when it comes to design for low power. We tend to think of mixed-signal as a few blocks like PLLs, ADCs and PHYs on the periphery of the design. Constrain and verify the digital power requirements up to analog … Read More
Eight Improvements for PCB Software
I first met John Durbetaki at Intel in Aloha, Oregon and we both had a keen interest in the nascent personal computer industry. My first PC was made by Radio Shack and dubbed the TRS-80 which maxed out at 48KB of RAM. I kept watch on Durbetaki as he left Intel and formed his own company OrCAD in 1985 to serve the needs of PC-based CAD software.… Read More
Software-Driven Verification Drives Tight Links between Emulation and Prototyping
I’ve mentioned many times what has become a very common theme in SoC and system verification – it has to be driven by the software because any concept of exhaustively verifying “everything” is neither feasible nor meaningful. Emulation has become a critical component of this flow in validating and regressing… Read More
Metric-Driven Verification for System Signoff
Everyone knows that verification is hard and is consuming an increasing percentage of verification time and effort. And everyone should know that system-level verification (SoC plus at least some software and maybe models for other components on a board) is even harder—which is why you see hand-wringing over how incompletely… Read More