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You’re Going to Want to Attend the Cadence Photonics Summit Workshop, October 19-20

You’re Going to Want to Attend the Cadence Photonics Summit Workshop, October 19-20
by Tom Dillinger on 10-05-2016 at 12:00 pm

Photonics IC’s (PIC’s) are used to transmit and receive data through a (single-mode or multi-mode) optical fiber carrier, and provide the requisite electro-optical conversion for system integration. The architecture of the PIC spans the full characteristics of data transmission and reception:

  • light generation

Typically,… Read More


"Rigid-Flex Design is Coming"

"Rigid-Flex Design is Coming"
by Tom Dillinger on 10-04-2016 at 12:00 pm

Printed circuit boards that incorporate a combination of traditional PCB technology with flexible substrates, aka rigid-flex designs, have enabled an increasing variety of product designs, that leverage the unique physical form factor and lightweight options that rigid-flex technology offers. Yet, this technology requires… Read More


Solutions for Variation Analysis at 16nm and Beyond

Solutions for Variation Analysis at 16nm and Beyond
by Tom Simon on 09-22-2016 at 7:00 am

Variation is still the tough nut to crack for advanced process nodes. The familiar refrain of lower operating voltages and higher performance requirements make process variation an extremely important design consideration. As far back as the early 2000’s design teams have been looking for a better approach to model variation… Read More


Emulation as a Multi-User Shareable Resource

Emulation as a Multi-User Shareable Resource
by Bernard Murphy on 09-19-2016 at 7:00 am

One of the great advantages of emulation is that runtimes are much faster than for simulation – sufficiently fast that you can really debug hardware together with software for comprehensive use-case testing. A not so great aspect is that emulators are expensive and, until relatively recently, not particularly easy to share across… Read More


The Package Assembly Design Kit (PADK)… the start of something big

The Package Assembly Design Kit (PADK)… the start of something big
by Tom Dillinger on 08-19-2016 at 12:00 pm

Integrated wafer-level fanout (WLFO) packaging technology is emerging as a foundation for multi-die solutions. Mobile product applications require focus on both aggressive chip-to-chip interface performance, as well as the final package volume. Traditional multi-chip packages using PCB laminate substrates do not readily… Read More


Custom layout productivity requires unrelenting EDA vendor focus

Custom layout productivity requires unrelenting EDA vendor focus
by Tom Dillinger on 08-05-2016 at 12:00 pm

The EDA tools industry relies upon ongoing productivity enhancements to existing products, to manage increasing SoC complexity and to address shrinking design schedules. The source of ideas for enhancements can come from a variety of sources – e.g., customer feedback, collaboration with the foundries, and features found … Read More


Formally Crossing the Chasm

Formally Crossing the Chasm
by Bernard Murphy on 07-25-2016 at 7:00 am

Formal verification for hardware was stuck for a long time with a reputation of being interesting but difficult to use and consequently limited to niche applications. Jasper worked hard to change this, particularly with their apps for JasperGold and I have been seeing more anecdotal information that mainstream adoption is growing.… Read More


IC Designers talk about 28nm to 7nm challenges at #53DAC

IC Designers talk about 28nm to 7nm challenges at #53DAC
by Daniel Payne on 06-20-2016 at 12:00 pm

IC design challenges are different at advanced nodes like 7nm, so to learn more about the topic I attended a panel luncheon at DAC sponsored by Cadence. The moderator was both funny and technically astute, quite the rare combination, so kudos to Professor Rob Rutenbar, a former Neolinear guy now at the University of Illinois. Panelists… Read More


Climbing the Infinite Verification Mountain

Climbing the Infinite Verification Mountain
by Bernard Murphy on 06-14-2016 at 7:00 am

Many years ago I read a great little book by Rudy Rucker called “Infinity and the Mind”. This book attempts to explain the many classes of mathematical infinity (cardinals) to non-specialists. As he gets to the more abstract levels of infinity, the author has to resort to an analogy to give a feel for extendible and other cardinal … Read More


Six Reasons to Visit Cadence at #53DAC this Year in Austin

Six Reasons to Visit Cadence at #53DAC this Year in Austin
by Daniel Payne on 05-29-2016 at 4:00 pm

For bloggers like myself spending four days at #53DAC is almost a non-stop blur of activity, visiting EDA vendors, IP providers and foundries to learn about what’s happening in our semiconductor industry. Cadence is both an EDA vendor and IP provider, so DAC is a great showcase for them to tell us what’s new in 2016 and… Read More