On Wednesday, October 9, 2019, I had the pleasure of spending the day at ARM Techcon at the San Jose Convention Center. In the morning, in addition to getting some sneak peeks into the exhibitor area, I attended some of the morning keynote presentations, which focused on artificial intelligence (AI) and machine learning (ML) topics.… Read More
Cadence Celsius Heats Up 3D System-Level Electro-Thermal Modeling Market
A few years back people were saying that the “EDA” problem was solved and that design tools had become commodity. At the same time people hailed ADAS, smart homes, mobile communication and AI as the frontiers of electronics. Perhaps it could be said that layout tools, routers, placers, and circuit simulators had largely matured… Read More
Lint for Implementation
When I was at Atrenta, we took advantage of opportunities to expand our static tool (aka linting) first to clock domain crossing (CDC) analysis and DFT compatibility and later to static analysis of timing constraints, all of which have importance in implementation. CDC is commonly thought of as an RTL-centric analysis, however,… Read More
Virtuoso Adapts to Address Cyber Physical Systems
LIDAR is a controversial topic, with even Elon Musk weighing in on whether it will ever be feasible for use in self driving cars. His contention is that the sensors will remain too expensive and potentially be unreliable because of their mechanical complexity. However, each of the sensors available for autonomous driving have … Read More
#DAC56 – Optimizing Verification Throughput for Advanced Designs in a Connected World
It was the final day of DAC56 and my head was already spinning from information overload after meeting so many people and hearing so many presentations, but I knew that IC functional verification was a huge topic and looming bottleneck for many SoC design teams, so I made a last-minute email request to attend a luncheon panel discussion… Read More
SiP is the new SoC @ 56thDAC
The emergence of 3D packaging technology has been accompanied by the term “more than Moore”, to reflect the increase in areal circuit density at a rate that exceeds the traditional IC scaling pace associated with Moore’s Law. At the recent Design Automation Conference in Las Vegas, numerous exhibits on the vendor floor presented… Read More
Parallel SPICE Circuit Simulator Debuts
In EDA the most successful companies will often re-write their software tools in order to add new features, improve accuracy, increase capacity and of course, shorten run times. For SPICE circuit simulators we typically look at several factors to see if a new tool is worth a look or not:
- Netlist compatibility
- Model support
- Foundry
JasperGold Gets Smarter, Faster and Easier for Signoff
Machine learning (ML) is already making its way into EDA tools and flows, but the majority of announcements have been around implementation, especially in guiding toward improved timing and area. This is a pretty obvious place to start; ML is in one sense an optimization technique, trained on prior examples, which should be able… Read More
Anirudh Keynote at CDNLive 2019
Anirudh Devgan (President of Cadence), gave the third keynote at CDNLive Silicon Valley this year. He has clearly become adept in this role. He has a big, but supportable vision for Cadence across markets and technologies and he’s become a master of the annual tech reveals that I usually associate with keynotes.
Anirudh opened … Read More
EDA Update 2019
Over the last six years EDA has experienced yet another disruption not unlike the Synopsys acquisition of Avant! in 2001 which positioned Synopsys for the EDA lead they still enjoy today. Or the hiring of famed venture capitalist Lip-Bu Tan in 2009 to be the CEO of struggling EDA pioneer Cadence Design Systems. Under Lip-Bu’s… Read More