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Project Verification Planning for Analog Designs

Project Verification Planning for Analog Designs
by Tom Dillinger on 02-18-2019 at 12:00 pm

Successful projects leverage the investment in comprehensive methodology and resource planning, covering design and analysis flows – that planning effort is especially important for functional verification.

The emergence of complex SoC designs for advanced automotive applications has led to a major focus on verification… Read More


At Last, Package and Chip integration for RF Design

At Last, Package and Chip integration for RF Design
by Tom Simon on 01-21-2019 at 7:00 am

It seems that it has always been that there were packages and ICs, and in the design tool world “never the twain shall meet”. The tools for designing packages were completely separate from the tools used to design IC’s. This was so profoundly true that even after Cadence merged with Valid Logic back in the early 90’s, their Allegro … Read More


Cadence Automotive Summit Sensor Enablement Highlights

Cadence Automotive Summit Sensor Enablement Highlights
by Camille Kokozaki on 12-18-2018 at 7:00 am

At the November 14 Cadence Automotive Summit, Ian Dennison, Senior Group Director, outlined sensor enablement technologies and SoC mixed-signal design solutions, from Virtuoso electrically aware design with high current, high reliability, yield and performance tools and methodologies enabling ADAS/AV sensors for vehicle… Read More


Photonics with CurvyCore

Photonics with CurvyCore
by Alex Tan on 12-17-2018 at 12:00 pm

As a preferred carrier to data or energy, photonics technology is becoming broad and diverse. In IC design, silicon-photonics technology has been the enabler of new capabilities and has revolutionized many applications as Moore’s-based scaling started to experience a slowdown. It acts as new on-chip inductor in HPC design … Read More


Cadence Summit Highlights Automotive Market Dynamics and System Enablement

Cadence Summit Highlights Automotive Market Dynamics and System Enablement
by Camille Kokozaki on 12-04-2018 at 12:00 pm

Cadence held a well-attended Automotive Summit where Cadence presented an overview of their solution and system enablement along with industry experts and established or startup companies sharing their perspective and product features from autonomous driving, LiDAR, Radar, thermal imaging, sensor imaging, and AI.… Read More


Emulation from In Circuit to In Virtual

Emulation from In Circuit to In Virtual
by Bernard Murphy on 11-08-2018 at 7:00 am

At a superficial level, emulation in the hardware design world is just a way to run a simulation faster. The design to be tested runs on the emulator, connected to whatever test mechanisms you desire, and the whole setup can run many orders of magnitude faster than it could if the design was running inside a software simulator. And … Read More


Solving and Simulating in the New Virtuoso RF Solution

Solving and Simulating in the New Virtuoso RF Solution
by Tom Simon on 10-30-2018 at 12:00 pm

Cadence has done a good job of keeping up with the needs of analog RF designs. Of course, the term RF used to be reserved for a thin slice of designs that were used specifically in RF applications. Now, it covers things like SerDes for networking chips that have to operate in the gigahertz range. Add that to the trend of combining RF and… Read More


IBIS-AMI Model Generation Simplified

IBIS-AMI Model Generation Simplified
by Tom Dillinger on 10-25-2018 at 12:00 pm

The increasing demand for data communication throughput between system components has driven the requirement for faster SerDes IP data rates. The complexity of the transmit (Tx) and receive (Rx) signal conditioning functions has correspondingly evolved. As a result, the simulation methodology for SerDes electrical interface… Read More


Meeting Analog Reliability Challenges Across the Product Life Cycle

Meeting Analog Reliability Challenges Across the Product Life Cycle
by Daniel Payne on 08-14-2018 at 12:00 pm

Create a panel discussion about analog IC design and reliability and my curiosity is instantly piqued, so I attended a luncheon discussion at #55DAC moderated by Steven Lewis of Cadence. The panelists were quite deep in their specialized fields:… Read More


A True Signoff for 7nm and Beyond

A True Signoff for 7nm and Beyond
by Alex Tan on 08-13-2018 at 12:00 pm

The Tale of Three Metrics
Meeting PPA (Performance, Power and Area) target is key to a successful design tapeout. These mainstream QoR (Quality of Results) metrics are rather empirical yet inter-correlated and have been expanded to be linked with other metrics such as yield, cost and reliability. While the recent CPU performance… Read More