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Thermal modeling has become a hot topic for designers of today’s high-speed circuits and complex packages. This has led to the adoption of better and more sophisticated thermal modeling tools and flows as exemplified in this presentation by Micron at the IDEAS Digital Forum. The presentation is titled “Thermal Aware Memory Controller… Read More
System on chip (SoC) based design has long been recognized as a powerful method to offer product differentiation through higher performance and expanded functionality. Yet, it comes with a number of limitations, such as high cost of development. Also, SoCs are monolithic, which can inhibit rapid adaptation in the face of changing… Read More
Ansys and Microsoft collaborated extensively over the past year to optimize and test Ansys’ signoff multiphysics simulation tools on the Azure cloud. Microsoft has invited Ansys to present the joint results in Azure’s DAC booth theater in San Francisco this year.
Two presentations are planned: covering the enablement of Ansys… Read More
The nearly unavoidable truth about dynamic voltage drop (DVD) signoff for power distribution networks (PDN) is that the quality of results depends on the quality and quantity of the vectors used to activate the circuit switching. As SOCs grow larger and are implemented on smaller nodes, the challenges of sufficient coverage … Read More
Automatic adaptive meshing in HFSS is a critical component of its advanced simulation process. Guided by Maxwell’s Equations, it efficiently refines the mesh to accurately capture both the geometric and electromagnetic detail of a design. The end result is a process that guarantees accurate and reliable simulation results… Read More
According to DARPA the fraction of total power consumed in semiconductors for I/O purposes as been growing rapidly and is creating an I/O power bottleneck. It has reached the point where it needs to be addressed with new technologies and approaches. Interestingly, while the energy density, as measured by pJ/bit for short reach… Read More
The truth is that we are just at the beginning of the Artificial Intelligent (AI) revolution. The capabilities of AI are just now starting to show hints of what the future holds. For instance, cars are using large complex neural network models to not only understand their environment, but to also steer and control themselves. For… Read More
The electronic design community is well aware that it faces a daunting challenge to analyze and sign off the next generation of huge multi-die 3D-IC systems. Most of today’s EDA tools require extraordinary resources in specialized computers with terabytes of RAM and hundreds of processors. Customers don’t want to keep buying… Read More
Ansys HFSS™ has long enjoyed industry respect as a highly accurate electromagnetic simulator suitable for general purpose applications. Ansys has worked over the years to maintain its gold reference accuracy, and also to dramatically improve its performance and ease of use. A very interesting review of the key technology breakthroughs… Read More
For those of you following the latest developments in electronic design it has become clear that the industry is transitioning through an inflection point that is shifting some of the ground rules of design. The increase in the speed and integration density in today’s systems are blurring the lines between chip design and system… Read More
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