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Matt Elmore has a two-part blog about the growing complexity of signal integrity analysis, both on the chip itself and the increasingly complex analysis required to make sure that signals (and power) get in and out of the chip from the board cleanly, especially to memory, which requires simultaneous analysis of chip-package-system… Read More
Last week I attended the Ansys/Apache seminars on “Dimensions of Electronic Design.” The two big challenges as we go down to 28nm and 20nm and below are keeping power manageable and keeping reliability up.
The big challenge with power is that we can put so much stuff on a die and clock it so fast that the power is exceeding… Read More
Qualcomm VP of Engineering, Charlie Matar, will be keynoting the Apache/ANSYS seminar in Santa Clara next Thursday. Charlie is a great guy and a great speaker so you won’t want to miss this and it’s FREE! I spoke to Charlie, he will be speaking on:
Today’s complex SOC design is driven by the constant demand for high performance… Read More
Coming up are ANSYS/Apache seminars on Dimensions of Electronic Design. Watch the video where Arvind Shanmugavel gives some details about why you should attend. Probably most readers are in Silicon Valley, and the seminar here is on 18th at the Hyatt (next to Santa Clara convention center).
The seminars are free to qualified attendees.… Read More
ANSYS and Apache are putting on a new series of seminars about designing future electronic systems. These are only getting more complex, of course, cramming more and more functionality into smaller portable devices with good battery life (and not getting too hot), integrating multiple antennas into a single platform, and TSV-based… Read More
On Wednesday this week Ansys/Ansoft/Apache are presenting a new webinar Chip Aware System Design. It is presented by Dr Steven Gary Pytel Jr of the Ansoft part of Ansys, and Matt Elmore of the Apache subsidiary. The topics that will be covered include:
Aveek Sarkar presented a webinar on chip-package-system (CPS) earlier this summer. One of the big challenges with low-power electronic systems is that the performance, power and price goals are mutually conflicting. It’s like the old joke about “pick any 2”. But for a real system all need to be optimized. … Read More
At DesignCon earlier this year, Tim Hollis of Micron gave an interesting presentation on 3D memories. For sure the first applications of true 3D chips are going to be stacks of memory die and memory on logic. The gains from high bandwidth access to the memory and the physically closer distance from memory to processor are huge.
Micron… Read More
Increasingly the challenge with SoCs, especially for mobile, is not getting the performance high enough but doing so in a power-efficient manner. Handheld devices running multiple apps need high-speed processors that consume extremely low levels of power both in operating and standby modes. In the server farm, the limit is … Read More
One of the really big changes about chip design is the way over the last decade or so it is no longer possible to design an SoC, a package for it to go in and the board for the package using different sets of tools and methodologies and then finally bond out the chip and solder it onto the board. The three systems, Chip-Package-System have… Read More
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