WP_Term Object
(
    [term_id] => 34
    [name] => Ansys, Inc.
    [slug] => ansys-inc
    [term_group] => 0
    [term_taxonomy_id] => 34
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 257
    [filter] => raw
    [cat_ID] => 34
    [category_count] => 257
    [category_description] => 
    [cat_name] => Ansys, Inc.
    [category_nicename] => ansys-inc
    [category_parent] => 157
    [is_post] => 
)
            
ansys sim world 2024 800X100 reg a (1)
WP_Term Object
(
    [term_id] => 34
    [name] => Ansys, Inc.
    [slug] => ansys-inc
    [term_group] => 0
    [term_taxonomy_id] => 34
    [taxonomy] => category
    [description] => 
    [parent] => 157
    [count] => 257
    [filter] => raw
    [cat_ID] => 34
    [category_count] => 257
    [category_description] => 
    [cat_name] => Ansys, Inc.
    [category_nicename] => ansys-inc
    [category_parent] => 157
    [is_post] => 
)

ESD Check Methodology

ESD Check Methodology
by Paul McLellan on 01-11-2013 at 5:12 pm

In Pune at the start of the month, Norman Chang, Ting-Sheng Ku, Jai Pollayil of Apache/Ansys and NVIDIA presented and ESD check methodologywith Fast Full-chip Static and Macro-level Dynamic Solutions . ESD stands for Elecro-Static Discharge and is basically injecting very high static voltages (think how your hand gets charged… Read More


Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis

Apache/Ansys presents: 3DIC thermal, transmission lines, low frequency analysis
by Paul McLellan on 12-16-2012 at 10:00 pm

Late in January it is DesignCon at the Santa Clara convention center from January 28th-31st. Details are here.

On Tuesday from 11.05 to 11.45 Apache and Ansys will be presenting on Thermal Co-analysis of 3D IC/packages/system. This is being presented by a whole team of people: Stephen Pan, senior product specialist at ANSYS; Norman… Read More


Apache Presents: ESD analysis

Apache Presents: ESD analysis
by Paul McLellan on 12-13-2012 at 1:15 am

The 26th Conference on VLSI Design will be in Pune, India from January 5th to 10th at the Hyatt Regency. Details on the conference here. Registration here. I happened to be involved in the first of these conferences, which was held in Edinburgh where I was wrapping up my PhD. It was in the considerably less palatial surroundings of … Read More


Apache Power Artist Capabilities II

Apache Power Artist Capabilities II
by Paul McLellan on 12-09-2012 at 4:00 pm

This is the second part of my discussion with Paul Traynar, Apache’s PowerArtist guru. The first part discussed sequential reduction capabilities. Part I was here.

There are two big challenges with doing power analysis at the RTL level. Firstly, how do you get an accurate enough model of what the design will dissipate given… Read More


Apache Power Artist Capabilities I

Apache Power Artist Capabilities I
by Paul McLellan on 12-06-2012 at 2:05 pm

I sat down last week with Paul Traynar who was over from UK. He is Apache’s PowerArtist guru. The first thing we talked about was PowerArtist’s sequential power reduction capabilities.

Forward propagation of enables means that when a register is clock gated and feeds a downstream register then that register can be… Read More


Apache on Signal Integrity

Apache on Signal Integrity
by Paul McLellan on 11-20-2012 at 1:09 pm

Matt Elmore has a two-part blog about the growing complexity of signal integrity analysis, both on the chip itself and the increasingly complex analysis required to make sure that signals (and power) get in and out of the chip from the board cleanly, especially to memory, which requires simultaneous analysis of chip-package-system… Read More


Power and Reliability Challenges

Power and Reliability Challenges
by Paul McLellan on 10-23-2012 at 12:38 pm

Last week I attended the Ansys/Apache seminars on “Dimensions of Electronic Design.” The two big challenges as we go down to 28nm and 20nm and below are keeping power manageable and keeping reliability up.

The big challenge with power is that we can put so much stuff on a die and clock it so fast that the power is exceeding… Read More


Challenges in Managing Power Consumption of Mobile SoC Chipsets: And What Lies Ahead When Your Hand-Held Is Your Compute Device!

Challenges in Managing Power Consumption of Mobile SoC Chipsets: And What Lies Ahead When Your Hand-Held Is Your Compute Device!
by Daniel Nenni on 10-10-2012 at 6:00 pm

Qualcomm VP of Engineering, Charlie Matar, will be keynoting the Apache/ANSYS seminar in Santa Clara next Thursday. Charlie is a great guy and a great speaker so you won’t want to miss this and it’s FREE! I spoke to Charlie, he will be speaking on:

Today’s complex SOC design is driven by the constant demand for high performanceRead More


Apache Dimensions of Electronic Design Seminars

Apache Dimensions of Electronic Design Seminars
by Paul McLellan on 10-07-2012 at 1:17 pm

Coming up are ANSYS/Apache seminars on Dimensions of Electronic Design. Watch the video where Arvind Shanmugavel gives some details about why you should attend. Probably most readers are in Silicon Valley, and the seminar here is on 18th at the Hyatt (next to Santa Clara convention center).

The seminars are free to qualified attendees.… Read More


Dimensions of Electronic Design Seminars

Dimensions of Electronic Design Seminars
by Paul McLellan on 10-02-2012 at 6:37 pm

ANSYS and Apache are putting on a new series of seminars about designing future electronic systems. These are only getting more complex, of course, cramming more and more functionality into smaller portable devices with good battery life (and not getting too hot), integrating multiple antennas into a single platform, and TSV-based… Read More