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RedHawk Excels – Customers Endorse

RedHawk Excels – Customers Endorse
by Pawan Fangaria on 05-28-2014 at 11:00 am

Since a few years, I have been following up Ansys Apachetools for semiconductor design, verification and sign-off. RedHawk is the most prominent platform of tools from Ansys, specifically for Power, Noise and Reliability Sign-off. It has witnessed many open endorsements from several of Ansyscustomers through open presentations,… Read More


Apache Design @ #51DAC Must See!

Apache Design @ #51DAC Must See!
by Daniel Nenni on 05-14-2014 at 8:00 pm

Register to hear industry experts from top semiconductor companies share their best practices that enable the next generation of high-performance, low power designs for mobile, automotive and other applications. Meet our technologists for in-depth presentations, case studies and demos on the industry’s leading simulation… Read More


IC Power Noise Reliability for FinFET Designs

IC Power Noise Reliability for FinFET Designs
by Daniel Payne on 05-06-2014 at 9:07 am

Reliability for ICs is a big deal because the last thing that you want to do is ship a new part only to find out later in the field that there are failures not being caught by testing. I’ve already had two consumer products fail this year because of probable reliability issues: My MacBook Pro with 16GB of RAM started rebooting caused… Read More


LSI’s Way of Faster & Reliable Electronic System Design

LSI’s Way of Faster & Reliable Electronic System Design
by Pawan Fangaria on 05-05-2014 at 9:30 am

LSI Corporationstarted in 1980s and I had several encounters with it during my jobs in 1990s; not to forget the LSI chips I used to see in desktops and other electronic systems, and I’m happy to see LSI continuing today with more vigour having leadership position in storage and networking space. It provides highly reliable, high … Read More


IC/Package/Board – Power, Noise and Reliability from ANSYS (Apache DA) at DAC

IC/Package/Board – Power, Noise and Reliability from ANSYS (Apache DA) at DAC
by Daniel Payne on 04-30-2014 at 10:04 am

ANSYS acquired Apache Design Automation back in June 2011and three years later the name “Apache” is being subdued in favor of using just ANSYS. One thing that I noticed right away was a DACfocus on having actual ANSYS customers talk about their hands-on experience using the EDA tools. The following seven customers… Read More


Fast & Accurate Thermal Analysis of 3D-ICs

Fast & Accurate Thermal Analysis of 3D-ICs
by Pawan Fangaria on 04-14-2014 at 11:00 am

As Moore’s law started saturating on a single semiconductor die, the semiconductor community came up with the approach of growing vertically by stacking dies one above other in a 3D-IC arrangement. However, a major concern with a 3D-IC is that the heat generated by each die can get trapped in the stack, and hence it’s extremely important… Read More


Early RTL Power Analysis and Reduction

Early RTL Power Analysis and Reduction
by Daniel Payne on 03-26-2014 at 4:48 pm

Power analysis and reduction for SoC designs is a popular topic because of our consumer electronics dominated economy, and the need to operate devices on a battery source for the maximum time before a recharge. Just from my desk I can see multiple battery-powered devices: Laptop, tablet, smart phone, e-book reader, bluetooth … Read More


Xilinx & Apache Team up for FPGA Reliability at 20nm

Xilinx & Apache Team up for FPGA Reliability at 20nm
by Pawan Fangaria on 03-17-2014 at 12:00 am

In this age of SoCs with hundreds of IPs from different sources integrated together and working at high operating frequencies, FPGA designers are hard pressed keeping up the chip reliability from issues arising out of excessive static & dynamic IR drop, power & ground noise, electro migration and so on. While the IPs are… Read More


How to meet 3Ps in 3D-ICs with sub-20nm Dies?

How to meet 3Ps in 3D-ICs with sub-20nm Dies?
by Pawan Fangaria on 03-06-2014 at 1:30 am

It feels to be at the top of semiconductor technology by having dies with high density of semiconductor design at sub-20nm technology node stacked together into a 3D-IC to form a complete SoC which can accommodate billions of gates. However there are multiple factors to be looked at in order to make that successful amid often conflicting… Read More


Who Won the DesignVision Awards at DesignCon this year?

Who Won the DesignVision Awards at DesignCon this year?
by Daniel Payne on 02-07-2014 at 7:37 pm

The Seattle Seahawks had an awesome victory in the SuperBowl against the Denver Broncos, so folks living here in the Pacific Northwest are feeling proud and optimistic. The recent DesignConconference and exhibit ended 10 days ago and there were also victors announced in terms of the annual DesignVision awards that have three … Read More