Samtec Delivers Ultra-High Density with Direct Connect™ to IC Package Technology

Samtec Delivers Ultra-High Density with Direct Connect™ to IC Package Technology
by Mike Gianfagna on 09-11-2020 at 6:00 am

Samtec Direct Connect to IC Package Technology

We all know the signal integrity and power integrity challenges of high-performance system design.  It used to be enough to design a robust chip. Now, the interaction between the chip, the substrate/package and the PCB all matter. If your design is 2.5D, as many are these days, the problems just gets worse. Chiplets are becoming… Read More


How HCL VersionVault Works – Directory Versioning

How HCL VersionVault Works – Directory Versioning
by Mike Gianfagna on 09-10-2020 at 10:00 am

Pieter Gosselink Senior Technical Support Engineer HCL Technologies

Last month, I discussed a webinar about HCL VersionVault – HCL VersionVault Delivers Version Control and More. This webinar introduced the HCL VersionVault product. This post will discuss a new video entitled “How HCL VersionVault Works – Directory Versioning.”

To recap, VersionVault delivers a lot of … Read More


Analog Bits at TSMC OIP – A Complete On-Die Clock Subsystem for PCIe Gen 5

Analog Bits at TSMC OIP – A Complete On-Die Clock Subsystem for PCIe Gen 5
by Mike Gianfagna on 09-09-2020 at 10:00 am

Design Integration of Complete On die Clock Subsystem for PCIe Gen 5

This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC.  The talk covered here focuses on a complete on-die clock … Read More


Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process

Dolphin Design – Delivering High-Performance Audio Processing with TSMC’s 22ULL Process
by Mike Gianfagna on 09-07-2020 at 10:00 am

Dolphin Design – Delivering High Performance Audio Processing with TSMCs 22ULL Process

TSMC held their very popular Open Innovation Platform event (OIP) on August 25. The event was virtual of course and was packed with great presentations from TSMC’s vast ecosystem. One very interesting and relevant presentation was from Dolphin Design, discussing the delivery of high-performance audio processing using TSMC’s… Read More


Alchip at TSMC OIP – Reticle Size Design and Chiplet Capabilities

Alchip at TSMC OIP – Reticle Size Design and Chiplet Capabilities
by Mike Gianfagna on 09-04-2020 at 10:00 am

Alchip machine learning design

This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC.  This presentation is from Alchip, presented by James Huang,… Read More


Cerebras and Analog Bits at TSMC OIP – Collaboration on the Largest and Most Powerful AI Chip in the World

Cerebras and Analog Bits at TSMC OIP – Collaboration on the Largest and Most Powerful AI Chip in the World
by Mike Gianfagna on 09-03-2020 at 6:00 am

Cerebras Wafer Scale Engine

This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The topic at hand was full of superlatives, which isn’t surprising… Read More


Webinar: Maximize Performance Using FPGAs with PCIe Gen5 Interfaces

Webinar: Maximize Performance Using FPGAs with PCIe Gen5 Interfaces
by Mike Gianfagna on 09-01-2020 at 10:00 am

Maximize Maximize Performance Using FPGAs with PCIe Gen5 Interfaces

FPGAs are a popular method to implement hardware accelerators for applications such as AI/ML, SmartNICs and storage acceleration. PCIe Gen5 is a high bandwidth communication protocol that is a key enabler for this class of applications. Putting all this together presents significant demands on the FPGA for performance and … Read More


Moving to Deeply Scaled Nodes for Power? There is a Better Way

Moving to Deeply Scaled Nodes for Power? There is a Better Way
by Mike Gianfagna on 08-24-2020 at 10:00 am

AGGIOS Definition

Did you know you can save 30% to 60% power without spending a fortune on a process migration? There is a better way than moving to deeply scaled nodes for power. Read on…

Have you heard of AGGIOS? You will. The name stands for AGGregated IO Systems, and a team of ex ARM and Qualcomm engineers are re-inventing power management. I’ll explain… Read More


HCL Webinar Series – HCL Compass Delivers Defect Tracking and More

HCL Webinar Series – HCL Compass Delivers Defect Tracking and More
by Mike Gianfagna on 08-21-2020 at 10:00 am

Screen Shot 2020 08 02 at 9.37.53 PM

Similar to my last post on the HCL DevOps webinar series, I will cover their presentation of HCL Compass in a webinar that was recorded on July 29 about how HCL Compass delivers defect tracking and more.

This webinar was presented by Steve Boone, head of product management at HCL Software DevOps, Howie Bernstein, product manager… Read More


The Big Three Weigh in on Emulation Best Practices

The Big Three Weigh in on Emulation Best Practices
by Mike Gianfagna on 08-18-2020 at 10:00 am

Emulation Best Practices

As software content increases in system-on-chip and system-in-package designs, emulation has become a critical enabling technology for the software team. This technology offers software developers the opportunity to verify their code in against a high-fidelity model of the target system that actually executes fast enough… Read More