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Introduction
For many years, I pondered the ultimate future of EDA. Companies such as Oracle, SAP and Dassault provide a huge array of enabling software infrastructure for the enterprise, including product design, mechanical design, project management and materials sourcing. But not for the all-important tasks of chip and… Read More
SLM. It’s a TLA (three-letter acronym) that you’ll be hearing more about. It stands for silicon lifecycle management and it has the potential of re-defining the role of EDA in the entire electronics ecosystem. A working definition of SLM is “monitoring, analysis and optimization of semiconductor devices as they are designed,… Read More
In April, I covered a new AI inference chip from Flex Logix. Called InferX X1, this part had some very promising performance metrics. Rather than the data center, the chip focused on accelerating AI inference at the edge, where power and form factor are key metrics for success. The initial information on the chip was presented at … Read More
Anyone who frequents SemiWiki will likely know Moore’s Law. The prediction made by Gordon Moore over 50 years ago regarding the relentless increase in transistor density and reduction in cost has tracked well for a very, very long time. In recent years, there has been spirited discussion about the end of Moore’s Law. This is a discussion… Read More
The semiconductor industry is fiercely competitive. This is widely known by the SemiWiki community. When it comes to critical design parameters such as power, performance or area you’re either in the envelope that defines the market or you’re not a player. Yield management has a similar impact. Those who can stay ahead of the yield… Read More
In a recent post, I discussed how NetApp provides comprehensive support for moving your EDA flow to the cloud. In that post, I explored the tools, technologies and services that help design organizations move to the cloud in a coherent, predictable, and incremental manner. Having a smooth-running hybrid/on-premise or… Read More
Virtual conferences are getting better all the time. Easy-to-navigate agendas, good production value in terms of visual presentation, professionally produced video segments and interspersed live events all contribute to the experience. Arm held their developers’ summit in the US on October 6-8, and it had all the attributes… Read More
In July, I explored the benefits of the new Cadence Tempus™ Power Integrity Solution. In that piece, I explored some of the unique capabilities of this new tool with Brandon Bautz, senior product management group director and Hitendra Divecha, product management director in the Digital & Signoff Group at Cadence. I recently… Read More
In July, I covered a webinar that described how yieldHUB helps bring a new product to market. That webinar described how to implement new production introduction (NPI) using an array of tools and techniques that should be part of any semiconductor enterprise. In a recent article published by yieldHUB, they took a few steps back … Read More
I had a chance to preview the subject webinar recently. Yes, it’s a long title, but a very important topic. When it comes to hyper-scale data centers, there are substantial challenges associate with thermal management, power distribution and processing performance. Moortec explores approaches to these issues using their … Read More
Unlocking the cloud: A new era for post-tapeout flow for semiconductor manufacturing