Tempus: Delivering Faster Timing Signoff with Optimal PPA

Tempus: Delivering Faster Timing Signoff with Optimal PPA
by Mike Gianfagna on 10-12-2020 at 10:00 am

Tempus Delivering Faster Timing Signoff with Optimal PPA

In July, I explored the benefits of the new Cadence Tempus™ Power Integrity Solution. In that piece, I explored some of the unique capabilities of this new tool with Brandon Bautz, senior product management group director and Hitendra Divecha, product management director in the Digital & Signoff Group at Cadence. I recently… Read More


yieldHUB – A Yield Management Checklist for Startups and a New Look

yieldHUB – A Yield Management Checklist for Startups and a New Look
by Mike Gianfagna on 10-08-2020 at 10:00 am

yieldHub – A Yield Management Checklist for Startups and a New Look

In July, I covered a webinar that described how yieldHUB helps bring a new product to market. That webinar described how to implement new production introduction (NPI) using an array of tools and techniques that should be part of any semiconductor enterprise. In a recent article published by yieldHUB, they took a few steps back … Read More


Webinar: Addressing the Challenges of Hyper-scaling within Data Centers with Advanced Node Embedded Sensing Fabrics

Webinar: Addressing the Challenges of Hyper-scaling within Data Centers with Advanced Node Embedded Sensing Fabrics
by Mike Gianfagna on 10-06-2020 at 10:00 am

Webinar Reminder Image

I had a chance to preview the subject webinar recently.  Yes, it’s a long title, but a very important topic. When it comes to hyper-scale data centers, there are substantial challenges associate with thermal management, power distribution and processing performance. Moortec explores approaches to these issues using their … Read More


Achieve Superior Energy Efficiency – Body Bias for FDSOI

Achieve Superior Energy Efficiency – Body Bias for FDSOI
by Mike Gianfagna on 09-30-2020 at 10:00 am

Achieve Superior Energy Efficiency – Body Bias for FDSOI

Silicon on insulator (SOI) technology has been around a very long time. I recall five-inch wafers full of SoS (silicon on sapphire) devices while working at the RCA Solid State Technology Center back in the dawn of time. Today, the concept of silicon on insulator is alive and well. Companies like GLOBALFOUNDRIES offer a special … Read More


Altair HPC Virtual Summit 2020 – The Latest in Enterprise Computing

Altair HPC Virtual Summit 2020 – The Latest in Enterprise Computing
by Mike Gianfagna on 09-28-2020 at 10:00 am

Altair HPC Virtual Summit 2020 – The Latest in Enterprise Computing

On September 9 and 10 Altair held their high-performance computing virtual summit. Altair is a company with a large footprint. In their own words, “Altair is a global technology company that provides software and cloud solutions in the areas of data analytics, product development, and high-performance computing (HPC).” Their… Read More


112G/56G SerDes – Select the Right PAM4 SerDes for Your Application

112G/56G SerDes – Select the Right PAM4 SerDes for Your Application
by Mike Gianfagna on 09-24-2020 at 10:00 am

112G56G SerDes Select the right PAM4 SerDes for your application

This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. Not all SerDes are the same. The presentation covered here,… Read More


AI/ML SoCs Get a Boost from Synopsys IP on TSMC’s 7nm and 5nm

AI/ML SoCs Get a Boost from Synopsys IP on TSMC’s 7nm and 5nm
by Mike Gianfagna on 09-22-2020 at 10:00 am

AIML SoCs Get a Boost from Synopsys IP on TSMCs 7nm and 5nm

This is another installment covering TSMC’s very popular Open Innovation Platform event (OIP), held on August 25. This event presents a diverse and high-impact series of presentations describing how TSMC’s vast ecosystem collaborates with each other and with TSMC. The presentation covered here from Synopsys focuses on the… Read More


Parallel-Based PHY IP for Die-to-Die Connectivity

Parallel-Based PHY IP for Die-to-Die Connectivity
by Mike Gianfagna on 09-17-2020 at 10:00 am

Two converging trends for die to die connectivity in MCMs 1

 

Synopsys has released a Technical Bulletin entitled “Parallel-Based PHY IP for Die-to-Die Connectivity”. The piece is authored by Manuel Mota, senior product marketing manager, staff at Synopsys. Manuel has worked at Synopsys for 11 years in the IP area. Prior to that, he worked at MIPS Technologies, Chipidea (acquired… Read More


Trusted IoT Ecosystem for Security – Created by the GSA and Chaired by Mentor/Siemens

Trusted IoT Ecosystem for Security – Created by the GSA and Chaired by Mentor/Siemens
by Mike Gianfagna on 09-14-2020 at 10:00 am

MentorSiemens and the GSA Team to Create a Trusted IoT Ecosystem

There’s a lot to keep you awake at night these days. If you live in California, it’s wildfires and unbreathable air. If you live on planet Earth, it’s COVID-19. And if you’re part of the value chain for IoT, it’s the security and robustness of the silicon and software fabric that connects our world. This fabric connects everything,… Read More


Samtec Delivers Ultra-High Density with Direct Connect™ to IC Package Technology

Samtec Delivers Ultra-High Density with Direct Connect™ to IC Package Technology
by Mike Gianfagna on 09-11-2020 at 6:00 am

Samtec Direct Connect to IC Package Technology

We all know the signal integrity and power integrity challenges of high-performance system design.  It used to be enough to design a robust chip. Now, the interaction between the chip, the substrate/package and the PCB all matter. If your design is 2.5D, as many are these days, the problems just gets worse. Chiplets are becoming… Read More