The development of cost effective, high-performance silicon to silicon interconnect at the system level can be a vexing problem. So many choices, which one will work best? Ease of use and customer support are woven into the DNA of Samtec. Almost four years ago I explored the company’s focus on putting the customer first here. Fast-forward… Read More
Author: Mike Gianfagna
Samtec Simplifies Complex Interconnect Design with Solution Blocks
IROC Introduces an Upgraded Solution for Soft Error Analysis and Mitigation #61DAC
#61DAC Is the place to go for the latest ideas, technology and products for semiconductor design and manufacturing. Between the exhibit floor and the technical program, you can get a vast education on almost any topic. In this post, I will focus on a unique company and a new version of a unique solution. IROC Technologies specializes… Read More
How Sarcina Revolutionizes Advanced Packaging #61DAC
#61DAC was buzzing with discussion of chiplet-based, heterogeneous design. This new design approach opens new opportunities for applications such as AI, autonomous driving and even quantum computing. A critical enabler for all this to work is reliable, cost-effective advanced packaging, and that is the topic of this post.… Read More
Codasip Makes it Easier and Safer to Design Custom RISC-V Processors #61DAC
RISC-V continued to be a significant force at #61DAC. There were many events that focused on its application in a wide variety of markets. As anyone who has used an embedded processor knows, the trick is how to be competitive. Using the same core as everyone else and differentiating in software is a strategy that tends to run out of … Read More
Who Are the Next Anchor Tenants at DAC? #61DAC
#61DAC is evolving. The big get bigger and ultimately focus on other venues for customer outreach and branding. This is a normal evolution in any industry. For EDA, it was noticed by many that Cadence and Synopsys have downsized their booths at DAC. Everyone knows CDNLive and SNUG are very successful events for these companies and… Read More
Breker Brings RISC-V Verification to the Next Level #61DAC
RISC-V is clearly gaining momentum across many applications. That was quite clear at #61DAC as well. Breker Verification Systems solves challenges across the functional verification process for large, complex semiconductors. Its Trek family of products is production-proven at many leading semiconductor companies worldwide.… Read More
Intel’s Gary Patton Shows the Way to a Systems Foundry #61DAC
#61DAC was buzzing this year with talk of AI and multi-die, heterogeneous design. The promise of making 2.5/3D design and a chiplet ecosystem mainstream reality was the focus of a lot of the panels and presentations at the conference. AI is certainly a driver for this new design style, but the conversation was broader than just AI,… Read More
Siemens Provides a Complete 3D IC Solution with Innovator3D IC
Heterogeneous multi-die integration is gaining more momentum all the time. The limited roadmap offered by Moore’s Law monolithic, single-die integration has opened the door to a new era of more-than-Moore heterogeneous integration. The prospects offered by this new design paradigm are exciting and the entire ecosystem is… Read More
How IROC Makes the World a Safer Place with Unique Soft Error Analysis
I recently had an eye-opening discussion regarding the phenomena of soft errors in semiconductor devices. I always knew this could be a problem in space, where there are all kinds of high energy particles. What I didn’t realize is there are two trends that are making this kind of problem relevant on the ground as well as in space. The… Read More
TSMC Advanced Packaging Overcomes the Complexities of Multi-Die Design
The TSMC Technology Symposium provides a worldwide stage for TSMC to showcase its advanced technology impact and the extensive ecosystem that is part of the company’s vast reach. These events occur around the world and the schedule is winding down. TSMC covers many topics at its Technology Symposium, including industry-leading… Read More
Has ASML Reached the Great Wall of China