Smart card business is now more than 25 years old, we can assess that the semiconductor industry is able to protect the chips used for smart card or SIM application with a very good level (unfortunately, it’s very difficult to get access to the fraud percentage linked with smart cards, as bankers really don’t like to communicate on… Read More
Author: Eric Esteve
How to Avoid Jeopardizing SoC Security when Implementing eSIM?
Bluetooth 5 IP is Ready for SoC Integration
Bluetooth®, WiFi, LTE, and 5G technologies enable wireless connectivity for a range of applications. While each offer unique features and advantages, designers need now to decide which protocol to integrate in a single chip after having test the market by using wireless off-chip solutions. Bluetooth 5 builds upon the success… Read More
Tensilica HiFi 3z DSP Core: Leading Energy Efficiency
Tensilica HiFi DSP family, dedicated to voice and audio processing, is shipping over 1 billion units worldwide annually, thanks to the 75+ licensees. The new HiFi 3z architecture offers more than 1.3X better voice and audio processing performance than its predecessor, the HiFi 3 DSP, which leads the industry in the number of audio… Read More
Why Embedded FPGA is a New IP Category?
Yes, embedded FPGA is clearly an IP function, or design IP, and not a software tool or anything else. The idea to embed an FPGA block into an ASIC is not new, I remember the discussions we had in the ASIC marketing team when I was working for Atmel, back in 2000. What is new is the big interest for eFPGA in the semiconductor industry, even… Read More
Synopsys New EV6x Offers 4X More Performance to CNN
When Synopsys bought Virage Logic in 2010, ARC processor IP was in the basket, but at that time ARC processor core was not the most powerful on the market, and by far. The launch of EV6x vision processor sounds like Synopsys has moved ARC processor core by several orders of magnitude in term of processing power. EV6x deliver up to 4X … Read More
LETI Days 2017: FD-SOI, Sensors and Power to Sustain Auto and IoT
I have attended last week to the LETI Days in Grenoble, lasting two days to mark the 50[SUP]th[/SUP] anniversary of the CEA subsidiary. Attending to the LETI Days is always a rich experience: LETI is a research center counting about 3000 research engineers, but LETI is also a start-up nursery. The presentations are ranging from … Read More
Don’t Miss “The IP Paradox” Panel @ #54 DAC!
Despite the strong consolidation in the semiconductor industry, the Design IP market is still growing: from $3 billion in 2015 to $3.4 billion in 2016. That’s why the DAC IP Committee has organized this panel, titled “The IP Paradox: Growing Business Despite Consolidations” (you can see more on the events page: https://dac.com/events… Read More
Worldwide Design IP Revenue Grew 13.1% in 2016, According to Final Results by IPnest
Despite the strong consolidation in the semiconductor industry, the Design IP market is going well, very well with YoY growth of 13.1% in 2016, according with the Design IP Report from IPnest. ARM Group of Softbank (previously known as ARM Holding) is again the strong #1 with IP revenues (licenses plus royalties) of $1,647 million… Read More
CCIX Protocol Push PCI Express 4.0 up to 25G
The CCIX consortium has developed the Cache Coherent Interconnect for Accelerators (X) protocol. The goal is to support cache coherency, allowing faster and more efficient sharing of memory between processors and accelerators, while utilizing PCIe 4.0 as transport layer. With Ethernet, PCI Express is certainly the most popular… Read More
Webinar: Achieving Very High Bandwidth Chip-to-Chip Communication with the Interlaken Interface Protocol
Open Silicon will hold this webinar on June 13th at 8 am PDT (or 5 pm CE) to describe their Interlaken IP core, and how to achieve very high bandwidth C2C communication in various networking applications. To be more specific, the Interlaken protocol can be used to support Packet Processing/NPU, Traffic Management, Switch Fabric,… Read More
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