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Samsung is a complicated company with a VERY long history. We attempted to capture the Samsung Experience in chapter 8 of our book “Mobile Unleashed: The Origin and Evolution of ARM Processors In Our Devices”. If you are a registered SemiWiki member you can download a free PDF copy in our Books section.
Here is the chapter 8 … Read More
This will be a combination of the recent TSMC quarterly report, a look back at Cliff Hou’s keynote at the most recent TSMC conference, and conversations on SemiWiki.com. There has been a lot of press on this but of course the most important points are being missed. Semiconductors are complicated and getting more so, absolutely.… Read More
In September, ClioSoft gave a SemiWiki webinar titled, Reusing Your IPs & PDKs Successfully With Cadence® Virtuoso®. I was happy to be the moderator of this webinar, having had the chance to work with ClioSoft’s team over many years. The webinar was informative while also being very time efficient. I think it is important for… Read More
Siemens Mentor recently announced PAVE360™, a very cool comprehensive pre silicon simulation environment. Autonomous cars are very popular here in Silicon Valley and quite safe on the highways since the average speed is 25mph (horrible traffic). In the city you need autonomous parking unless you want to waste precious time … Read More
One of my great pleasures in the semiconductor industry is meeting the people who have brought us to where we are today, at the forefront of modern life. One of those people is Babak Taheri, now CEO of Silvaco who I spent time with yesterday. Babak started in semiconductors around the same time I did 30+ years ago. He has a PhD in EECS and… Read More
One of the reasons I founded SemiWiki nine years ago was the lack of EDA, IP and Foundry content in the media. The problem is that unless you work in the industry it is very difficult to write about it in competent technical detail. Most media outlets only know what vendors tell them which is how the semiconductor industry worked before… Read More
IPs have an attack surface that indicates how they can be compromised in real world scenarios. Some portions of the attack surfaces are well known, others are discovered during analysis, testing or out in the field. SoCs that use large collections of IPs need a systematic and reliable way to determine the various security vulnerabilities… Read More
At the recent Open Innovation Platform® Ecosystem Forum in Santa Clara, TSMC provided an enlightening look into the future of heterogeneous packaging technology. Although the term chiplet packaging is often used to describe the integration of multiple silicon die of potentially widely-varying functionality, this article… Read More
Each year, TSMC conducts two events – the Technology symposium in the Spring and the Open Innovation Platform (OIP) ® Ecosystem Forum in the Fall. Yet, what is the OIP ecosystem? What does it encompass? And, how does the program differentiate TSMC from other foundries? At the recent OIP Forum in Santa Clara, Suk Lee, Senior Director,… Read More
The old adage that goes the one constant thing you can always count on is change, could easily be reworded for semiconductor design to say the one constant thing you can count on is variation. This is doubly true. Not only is variation, in all its forms, a constant factor in design, additionally the methods of analyzing and dealing … Read More
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